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Title:
【発明の名称】研磨のための被加工物の保持具及びその製法
Document Type and Number:
Japanese Patent JP3072962
Kind Code:
B2
Abstract:
A retaining device retains a workpiece to allow the workpiece to slide against a polishing pad located on a polishing board opposed to the retaining device. The retaining device includes a plate including a permeable portion and a seal portion having a lower permeability and provided around an outer periphery of the permeable portion. By absorbing air toward a first surface of the permeable portion, the workpiece is attached and attracted to a second surface of the permeable portion opposite to the first surface. The retaining device further includes a retainer ring provided on an outer peripheral portion of the plate for preventing an outer edge of the workpiece from being overhung by polishing; and a backup ring located between the plate and the retainer ring for putting the retainer ring into pressure contact with the polishing pad. Since the workpiece can be attached and attracted to or released from the plate by a simple operation, the time required for retaining the plate is shortened. Further, the damage to other machines and equipment used for workpiece retaining which is caused by the polishing liquid is alleviated, and thus the maintenance of such machines and equipment becomes easier. Moreover, the flatness of the polished workpiece is improved.

Inventors:
Naoto Kubo
Yoshitane Shigeta
Hideyuki Ishii
Application Number:
JP31338095A
Publication Date:
August 07, 2000
Filing Date:
November 30, 1995
Export Citation:
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Assignee:
Rodale Nitta Co., Ltd.
International Classes:
B24B37/04; B24B37/30; B24B37/32; B25B11/00; H01L21/304; (IPC1-7): B24B37/04; H01L21/304
Domestic Patent References:
JP62124844A
JP720248U
JP7263386U
Attorney, Agent or Firm:
Shusaku Yamamoto