Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
An injection-molding device and an injection molding method
Document Type and Number:
Japanese Patent JP6130533
Kind Code:
B2
Abstract:
The present invention provides an injection molding apparatus and an injection molding method for a resin material containing reinforcing fibers capable of preventing or suppressing an irregularity in a content of the reinforcing fibers, and obtaining a stable molding quality. The injection molding apparatus of the present invention includes: a heating cylinder 201; a screw 10 that is provided rotatably in an inner portion of the heating cylinder 201; a resin feed hopper 207 that feeds a resin pellet P; and a fiber feed device 213 that is provided ahead of the resin feed hopper 207 and feeds reinforcing fibers into the heating cylinder 201. The screw 10 includes a first stage 21 that is located on a rear side, and in which the resin pellet P is melted, and a second stage 22 that is located on a front side, and in which the melted resin pellet P and the reinforcing fibers F are mixed, and a lead L2 of a second thread 28 provided in the second stage 22 is larger than a lead L1 of a first thread 27 provided in the first stage 21.

Inventors:
Toshihiko Kariya
Naoki Toda
Munehiro Shinoda
Kiyoshi Kinoshita
Yuji Yamaguchi
Kousuke Ikeda
Suzumura Yuji
Hitoshi Onuma
Ryoji Okabe
Masanori Takahashi
Application Number:
JP2016030644A
Publication Date:
May 17, 2017
Filing Date:
February 22, 2016
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
u-mhi Platec Co., Ltd.
MITSUBISHI HEAVY INDUSTRIES,LTD.
International Classes:
B29C45/18; B29C45/46
Domestic Patent References:
JP8091164A
JP6238655A
JP2000263547A
JP2007015382A
JP2014046631A
JP10156901A
Attorney, Agent or Firm:
Mitsuru Oba
Horikawa Miyuki
Yuko Otake
Yamashita Seiko