Title:
An injection-molding device and an injection molding method
Document Type and Number:
Japanese Patent JP6130533
Kind Code:
B2
Abstract:
The present invention provides an injection molding apparatus and an injection molding method for a resin material containing reinforcing fibers capable of preventing or suppressing an irregularity in a content of the reinforcing fibers, and obtaining a stable molding quality. The injection molding apparatus of the present invention includes: a heating cylinder 201; a screw 10 that is provided rotatably in an inner portion of the heating cylinder 201; a resin feed hopper 207 that feeds a resin pellet P; and a fiber feed device 213 that is provided ahead of the resin feed hopper 207 and feeds reinforcing fibers into the heating cylinder 201. The screw 10 includes a first stage 21 that is located on a rear side, and in which the resin pellet P is melted, and a second stage 22 that is located on a front side, and in which the melted resin pellet P and the reinforcing fibers F are mixed, and a lead L2 of a second thread 28 provided in the second stage 22 is larger than a lead L1 of a first thread 27 provided in the first stage 21.
Inventors:
Toshihiko Kariya
Naoki Toda
Munehiro Shinoda
Kiyoshi Kinoshita
Yuji Yamaguchi
Kousuke Ikeda
Suzumura Yuji
Hitoshi Onuma
Ryoji Okabe
Masanori Takahashi
Naoki Toda
Munehiro Shinoda
Kiyoshi Kinoshita
Yuji Yamaguchi
Kousuke Ikeda
Suzumura Yuji
Hitoshi Onuma
Ryoji Okabe
Masanori Takahashi
Application Number:
JP2016030644A
Publication Date:
May 17, 2017
Filing Date:
February 22, 2016
Export Citation:
Assignee:
u-mhi Platec Co., Ltd.
MITSUBISHI HEAVY INDUSTRIES,LTD.
MITSUBISHI HEAVY INDUSTRIES,LTD.
International Classes:
B29C45/18; B29C45/46
Domestic Patent References:
JP8091164A | ||||
JP6238655A | ||||
JP2000263547A | ||||
JP2007015382A | ||||
JP2014046631A | ||||
JP10156901A |
Attorney, Agent or Firm:
Mitsuru Oba
Horikawa Miyuki
Yuko Otake
Yamashita Seiko
Horikawa Miyuki
Yuko Otake
Yamashita Seiko
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