Title:
A large-sized resin-molding article for vehicles, and a manufacturing method for the same
Document Type and Number:
Japanese Patent JP6058956
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a large-sized resin molding for a vehicle, which enables high-precision molding of an attachment location for being attached to a vehicle body, and a method of manufacturing the same.SOLUTION: A bumper 11 includes: a bumper body 13; one fixing part molding 15 that is integrally attached to the bumper body 13 by secondary resin molding; and a pair of clips 17 that are molded integrally with the fixing part molding 15 in the secondary resin molding and that are mutually arranged in predetermined relative positions depending on a pair of attachment holes 39 of a vehicle body 37 subjected to the attachment of the bumper body 13.
Inventors:
Mitsugu Watanabe
Application Number:
JP2012207415A
Publication Date:
January 11, 2017
Filing Date:
September 20, 2012
Export Citation:
Assignee:
Yazaki Corporation
International Classes:
B60R19/03; B29C69/02; B60J5/04; B60K37/00; B60R13/02; B62D25/06; B62D29/04
Domestic Patent References:
JP56143141U | ||||
JP2006239892A | ||||
JP2007137080A | ||||
JP2008074350A | ||||
JP59199227A | ||||
JP2000103302A |
Attorney, Agent or Firm:
Patent business corporation glory patent office
Hironori Honda
Kiharu Masaharu
Toshimitsu Ichikawa
Hironori Honda
Kiharu Masaharu
Toshimitsu Ichikawa