Title:
LEAD-FREE SOLDER COMPOSITION HAVING HIGH DUCTILITY
Document Type and Number:
Japanese Patent JP2017170521
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a lead-free solder composition which has excellent ductility and stability.SOLUTION: A lead-free solder composition containing: 0.02 to 6 wt.% of antimony; 0.03 to 3 wt.% of copper; 0.03 to 8 wt.% of bismuth; 42 to 70 wt.% of indium; 0.3 to 8 wt.% of silver; 5 to 11 wt.% of magnesium; 0.8 to 1.6 wt.% of scandium; 0.7 to 2.0 wt.% of yttrium; and 10 to 45 wt.% of tin. This lead-free solder composition has a solidus line temperature of 120°C or higher, and has excellent ductility and stability, and therefore, this composition is suitable for soldering an electric connector to a metallized surface of a glass.SELECTED DRAWING: None
Inventors:
HUANG SUIXIANG
Application Number:
JP2016171089A
Publication Date:
September 28, 2017
Filing Date:
September 01, 2016
Export Citation:
Assignee:
HEBEI LIXIN TECH CO LTD
International Classes:
B23K35/26; C22C28/00; C22C30/00
Attorney, Agent or Firm:
Hideno Kono
Nobuo Kono
Nobuo Kono
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