Title:
A leadframe for light emitting element mounting, a resin molding object, and a surface mount type luminescent device
Document Type and Number:
Japanese Patent JP6241238
Kind Code:
B2
Inventors:
Morihiro Hori
Kakehashi Yasushi
Tomokazu Tozawa
Kakehashi Yasushi
Tomokazu Tozawa
Application Number:
JP2013251852A
Publication Date:
December 06, 2017
Filing Date:
December 05, 2013
Export Citation:
Assignee:
Kaneka Corporation
International Classes:
H01L33/62
Domestic Patent References:
| JP2013232506A | ||||
| JP2010056291A | ||||
| JP2014042011A |
Foreign References:
| WO2012060336A1 |
Attorney, Agent or Firm:
Takao Yanagino
Norio Morioka
Hisayoshi Sekiguchi
Masato Nakagawa
Norio Morioka
Hisayoshi Sekiguchi
Masato Nakagawa