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Title:
A manufacturing method of the filler constituent between layers for three-dimensional lamination type semiconductor devices, a three-dimensional lamination type semiconductor device, and a three-dimensional lamination type semiconductor device
Document Type and Number:
Japanese Patent JP6089510
Kind Code:
B2
Inventors:
Yasuhiro Kawase
Shin Ikemoto
Masanori Yamazaki
Hideki Kiritani
Application Number:
JP2012195091A
Publication Date:
March 08, 2017
Filing Date:
September 05, 2012
Export Citation:
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Assignee:
Mitsubishi Chemical Corporation
International Classes:
C08L101/00; C08K3/00; C08L63/00; H01L25/065; H01L25/07; H01L25/18
Domestic Patent References:
JP2006165353A
JP2011178894A
JP2012136689A
JP2005272814A
JP2007284670A
JP9151324A
JP2009224534A