Title:
砥粒分散液、およびこれを含む研磨用組成物キット、ならびにこれらを用いた研磨用組成物の製造方法、研磨用組成物、研磨方法および磁気ディスク用基板の製造方法
Document Type and Number:
Japanese Patent JP6680652
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a means capable of reducing fine scratch of a polishing object after polishing.SOLUTION: The invention relates to an abrasive grain dispersion having average primary particle diameter measured by a BET method of 1 nm to 50 nm and a dispersion, and having pH value of 7 to 12, and particle number of the abrasive grain with particle diameter of 0.2 μm or more and less than 0.3 μm measured by number count type particle size distribution counter of 25,000,000 or less per 1 cmwhen the content of the abrasive grain is converted to 30 mass% to total mass of the abrasive grain dispersion.SELECTED DRAWING: None
Inventors:
Tomohide Kamiya
Noritaka Yokomichi
Noritaka Yokomichi
Application Number:
JP2016175964A
Publication Date:
April 15, 2020
Filing Date:
September 08, 2016
Export Citation:
Assignee:
Fujimi Incorporated Co., Ltd.
International Classes:
C09K3/14; B24B37/00; C09G1/02; G11B5/84
Domestic Patent References:
| JP2012086357A | ||||
| JP2008179763A | ||||
| JP2008137822A | ||||
| JP2006075975A | ||||
| JP2001271058A | ||||
| JP2014239228A |
Attorney, Agent or Firm:
Hatta International Patent Corporation