Title:
パターン抽出方法,パターン抽出装置および半導体装置の製造方法
Document Type and Number:
Japanese Patent JP4857963
Kind Code:
B2
Inventors:
Moriya Shigeru
Application Number:
JP2006185927A
Publication Date:
January 18, 2012
Filing Date:
July 05, 2006
Export Citation:
Assignee:
ソニー株式会社
International Classes:
H01L21/027; G03F7/20
Domestic Patent References:
| JP2002252158A | ||||
| JP2004259744A | ||||
| JP2001257145A | ||||
| JP2000508839A | ||||
| JP2000269128A |
Attorney, Agent or Firm:
Takahisa Sato