Title:
【発明の名称】半導体ウェーハの化学・機械研磨の終了点を検出する方法及び装置
Document Type and Number:
Japanese Patent JP2001515283
Kind Code:
A
Abstract:
A method and apparatus for detecting the endpoint of CMP processing on semiconductor wafer in which a lower layer of material with a first reflectivity is positioned under an upper layer of material with a second reflectivity. Initially an endpoint site is selected on the wafer in a critical area where a boundary between the upper and lower layers defines the desired endpoint of the CMP process. The critical area on the wafer is generally determined by analyzing in the circuit design and the polishing characteristics of previously polished test wafers to denote the last points on the wafer from which the upper layer is desirably removed by CMP processing. After an endpoint site is selected, a light beam impinges the polished surface of the wafer and reflects off of the surface of the wafer to a photo-sensor. The photosensor senses the actual intensity of the reflected light beam. The actual intensity of the reflected light beam is compared with an expected intensity to determine whether the upper layer has been adequately removed from the endpoint site. The actual intensity is preferably compared with an expected intensity for light reflected from one of the upper or lower layers, and the endpoint is preferably detected when the actual intensity of the reflected light beam is either substantially the same as the expected intensity for light reflected from the lower layer or substantially different from the expected intensity for light reflected from the upper layer.
Inventors:
Sundew Gertathing
Application Number:
JP2000509992A
Publication Date:
September 18, 2001
Filing Date:
August 19, 1998
Export Citation:
Assignee:
Micron Technology Inc.
International Classes:
B24B37/04; B24B49/04; B24B49/12; H01L21/304; G01B11/06; H01L21/306; H01L21/66; (IPC1-7): H01L21/304; G01B11/06; H01L21/306; H01L21/66
Attorney, Agent or Firm:
Minoru Nakamura (10 outside)