Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
スロット付き基板ならびにそれを形成するための方法
Document Type and Number:
Japanese Patent JP4549642
Kind Code:
B2
Abstract:
Methods and systems for forming slots in a print head substrate having a thickness defined by opposing first and second surfaces. In one exemplary embodiment, a trench is received in the first surface and extends through less than an entirety of the thickness of the substrate. A plurality of slots extends into the substrate from the second surface and connects with the trench to form a compound slot through the substrate. In this embodiment, the trench is wider at portions proximate to said slots than at portions more distant to said slots.

Inventors:
Jeffrey Earl Pollard
Application Number:
JP2003279607A
Publication Date:
September 22, 2010
Filing Date:
July 25, 2003
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
Hewlett-Packard Development Company
International Classes:
B41J2/05; B41J2/14; B41J2/16
Domestic Patent References:
JP6115075A
JP2002144576A
Attorney, Agent or Firm:
Satoshi Furuya
Takahiko Mizobe
Kiyoharu Nishiyama



 
Previous Patent: 換気フード

Next Patent: 入退室管理システム