Title:
光伝送基板および光伝送モジュール
Document Type and Number:
Japanese Patent JP5755158
Kind Code:
B2
Abstract:
An optical transmission board includes a substrate being provided with a through hole formed in a thickness direction of the substrate so as to penetrate from top to bottom of the substrate; a cladding member at least part of which locates inside the through hole, having an optical waveguide hole being inside the through hole and penetrating the cladding member in the thickness direction thereof, and having an upper surface having a surface roughness smaller than that of an upper surface of the substrate; a core member disposed inside the optical waveguide hole; an electrically conductive body disposed on the upper surface of the cladding member; and an optical element electrically connected to the electrically conductive body, having a light-receiving surface or a light-emitting surface opposed to an upper surface of the core member.
Inventors:
Maeya Maruaki
Application Number:
JP2012019699A
Publication Date:
July 29, 2015
Filing Date:
February 01, 2012
Export Citation:
Assignee:
Kyocera Corporation
International Classes:
G02B6/12; G02B6/122; G02B6/42
Domestic Patent References:
| JP4937425B2 | ||||
| JP2010134299A | ||||
| JP2010085438A | ||||
| JP2004318081A |