Title:
MOUNTING METHOD FOR FLIP CHIP
Document Type and Number:
Japanese Patent JPH0737934
Kind Code:
A
Abstract:
PURPOSE: To make it possible to perform a screening test before repairing and mounting of defective flip chips in a flip chip mounting method used for various electronic equipment.
CONSTITUTION: An Au electrode 22 is formed on an aluminum electrode 21 of a flip chip 23, the flip chip 23 is bonded to a metal holder 24 with an adhesive 25, conductor wiring 27 formed on an insulating body 26 is aligned with the Au electrode 22, the metal holder 24 is bonded to the insulating body 26 with a thermoplastic adhesive 28 supplied to the metal holder 24, thereby pressure-bonding the Au electrode 22 to the conductor wiring 27 and permitting the repair of defective flip-chip and screening test before mounting.
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Inventors:
AZUMA KAZUJI
Application Number:
JP15826693A
Publication Date:
February 07, 1995
Filing Date:
June 29, 1993
Export Citation:
Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
G01R31/28; H01L21/60; H01L21/66; (IPC1-7): H01L21/60; G01R31/28; H01L21/66
Attorney, Agent or Firm:
Yoshihiro Morimoto
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