Title:
研磨監視方法および研磨装置
Document Type and Number:
Japanese Patent JP5080933
Kind Code:
B2
Abstract:
The present invention provides a method of monitoring a change in film thickness during polishing using an eddy current sensor. This method includes acquiring an output signal of the eddy current sensor as a correction signal value during water-polishing of a substrate, during dressing of the polishing pad, or during replacement of the polishing pad, calculating a correcting amount from a difference between the correction signal value and a predetermined correction reference value, calculating an actual measurement signal value by subtracting the correction amount from the output signal of the eddy current sensor when polishing a substrate having a conductive film, and monitoring a change in thickness of the conductive film during polishing by monitoring a change in the actual measurement signal value.
Inventors:
Yoichi Kobayashi
Taro Takahashi
Yasumasa Hiroo
Akihiko Ogawa
Makoto Ohta
Taro Takahashi
Yasumasa Hiroo
Akihiko Ogawa
Makoto Ohta
Application Number:
JP2007271226A
Publication Date:
November 21, 2012
Filing Date:
October 18, 2007
Export Citation:
Assignee:
Ebara Corporation
International Classes:
H01L21/304; B24B37/013; G01B7/06
Domestic Patent References:
| JP2002148010A | ||||
| JP2005011977A | ||||
| JP2005121616A |
Attorney, Agent or Firm:
Isamu Watanabe
Ryoji Kosugi
Tetsuya Hirosawa
Ryoji Kosugi
Tetsuya Hirosawa