Title:
【発明の名称】高密度相互接続コンピユ―タ回路組立体
Document Type and Number:
Japanese Patent JP2514272
Kind Code:
B2
Abstract:
A high density circuit computer assembly is provided by placing TCMs on a support board together with a printed circuit (PC) interconnect board, power supplies for TCMs to form a book package which, in turn, is slidably mounted on edge of the support board to a bookcaselike frame between shelves of the bookcase. The panel of connectors for the TCMs are placed on the support board at one end of the package to present a front connecting surface along the front face of the bookcase-like frame. A flexible multi-conductor board is coupled between the panel of connectors and the PC board. Multi-conductor cables extend along the front face and interconnect the connectors from one book package to another book package.
Inventors:
JIIIN EDOWAADO KASA
JOSEFU WARUTON JIIINON
JOSEFU WARUTON JIIINON
Application Number:
JP23602090A
Publication Date:
July 10, 1996
Filing Date:
September 07, 1990
Export Citation:
Assignee:
INTAANASHONARU BIJINESU MASHIINZU CORP
International Classes:
H05K7/14; H05K7/18; H01R43/00; (IPC1-7): H05K7/14; H05K7/18
Domestic Patent References:
| JP63185289U | ||||
| JP5832692U | ||||
| JP5935011Y2 |
Attorney, Agent or Firm:
Jiro Yamamoto (1 person outside)