Title:
【発明の名称】電子回路の製造方法
Document Type and Number:
Japanese Patent JP3120695
Kind Code:
B2
Abstract:
The process for manufacturing an electronic circuit includes disposing an electronic device on a circuit substrate and hot melting a solder formed on the electronic device or the circuit substrate to bond the electronic device and the circuit substrate. The process includes the steps of feeding a liquid onto lands on the circuit substrate, aligning and mounting the electronic device on the lands, placing the circuit substrate in a treating vessel and heating the circuit substrate. The heating step includes controlling a pressure of an atmosphere in the treating vessel, hot-melting the solder to prevent at least a portion of the liquid from evaporating until the electronic device and the circuit substrate are bonded and to permit the liquid to evaporate after the electronic device and the circuit substrate are bonded.
Inventors:
Kaoru Katayama
Hiroshi Fukuda
Shinichi Wai
Toshihiko Ohta
Yasuhiro Iwata
Mitsugu Shirai
Mitsunori Tamura
Hiroshi Fukuda
Shinichi Wai
Toshihiko Ohta
Yasuhiro Iwata
Mitsugu Shirai
Mitsunori Tamura
Application Number:
JP12111895A
Publication Date:
December 25, 2000
Filing Date:
May 19, 1995
Export Citation:
Assignee:
株式会社日立製作所
International Classes:
H01L21/60; H05K3/34; B23K1/005; (IPC1-7): H05K3/34; B23K1/005
Domestic Patent References:
| JP799382A | ||||
| JP687067A | ||||
| JP6326449A | ||||
| JP6238757A |
Attorney, Agent or Firm:
Yasuo Sakuta