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Title:
【発明の名称】ICカード用カード基材の製造方法及び製造用金型
Document Type and Number:
Japanese Patent JP3007184
Kind Code:
B2
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Inventors:
Mitsunori Takeda
Yousuke Terada
Application Number:
JP15099991A
Publication Date:
February 07, 2000
Filing Date:
May 27, 1991
Export Citation:
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Assignee:
Dai Nippon Printing Co.,Ltd.
International Classes:
B29C45/26; B29C45/34; B29D22/00; B42D15/10; G06K19/077; B29L31/34; (IPC1-7): B29C45/26; B29C45/34; B29D22/00; B42D15/10
Domestic Patent References:
JP4347607A
JP61222715A
JP60217491A
Attorney, Agent or Firm:
Takahisa Sato



 
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