Title:
ポリイミドフィルムの製造方法
Document Type and Number:
Japanese Patent JP4006779
Kind Code:
B2
Abstract:
A method for producing a polyimide film in which the imidation ratio and/or the amount of volatile constituent are controlled to improve the adhesive strength of the polyimide film. The method may also comprise controlling the highest temperature of heating the prefilm to improve the adhesive strength of the polyimide film.
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Inventors:
Hiroshi Yamada
Fukudome
Naoki Egawa
Kondo
Haruhiko Maki
Fukudome
Naoki Egawa
Kondo
Haruhiko Maki
Application Number:
JP15358797A
Publication Date:
November 14, 2007
Filing Date:
June 11, 1997
Export Citation:
Assignee:
Kaneka Corporation
International Classes:
B29C41/46; C08J5/18; B29C41/24; B29C41/28; B29C71/02; B29D7/01; C08J7/00; C08K5/00; C08L79/08; B29K79/00; B29L7/00
Domestic Patent References:
| JP4198229A | ||||
| JP57029425A | ||||
| JP63006028A | ||||
| JP63061030A |
Attorney, Agent or Firm:
Takayoshi Kusumoto