Title:
【発明の名称】半導体回路の製造方法
Document Type and Number:
Japanese Patent JP2854846
Kind Code:
B2
Inventors:
SAWA TAKAO
KAWAKITA KATSUHIKO
HIROSE YORIO
KAWAKITA KATSUHIKO
HIROSE YORIO
Application Number:
JP26907896A
Publication Date:
February 10, 1999
Filing Date:
September 20, 1996
Export Citation:
Assignee:
TOSHIBA KK
International Classes:
C22C19/07; C22C38/00; H01F27/24; H01F41/02; (IPC1-7): H01F41/02; C22C19/07; C22C38/00; H01F27/24
Domestic Patent References:
| JP7118428B2 | ||||
| JP480523B2 |
Attorney, Agent or Firm:
Togawa Hideaki