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Title:
液浸露光用感放射線性樹脂組成物、硬化パターン形成方法及び硬化パターン
Document Type and Number:
Japanese Patent JP5771905
Kind Code:
B2
Abstract:
Provided is a radiation-sensitive resin composition for immersion exposure, a curing pattern forming method and a curing pattern ideally used in an immersion exposure process for exposing a resist film via a liquid for immersion exposure, such as water. The radiation-sensitive resin composition for immersion exposure comprises a structure obtained by hydrolysis-condensation of a silane compound represented by the formula [R1 aSiX4-a] and/or a silane compound represented by the formula [SiX4], and contains a silicon-containing polymer having a weight average molecular weight of 1,000 to 200,000 according to GPC, a fluorine-containing polymer, and an acid generator. (In each formula: R1 represents a fluorine atom, an alkylcarbonyloxy group, or an alkyl group with 1 to 20 carbons; X represents a chlorine atom, a bromine atom, or OR (where R is a monovalent organic group); and a represents an integer from 1 to 3.)

Inventors:
Koichi Hasegawa
Miyata
Yoshitomo Yasuda
Application Number:
JP2010110575A
Publication Date:
September 02, 2015
Filing Date:
May 12, 2010
Export Citation:
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Assignee:
JSR CORPORATION
International Classes:
G03F7/075; C08F212/14; C08F220/22; C08F232/02; C08G77/04; C08G77/50; G03F7/004; G03F7/039; G03F7/38; G03F7/40
Domestic Patent References:
JP2009008824A
JP2010102336A
JP2009258723A
JP2009098687A
JP9208704A
Foreign References:
WO2004076535A1
Attorney, Agent or Firm:
Kiyoshi Kojima