Title:
コイル端部の予備メッキ方法
Document Type and Number:
Japanese Patent JP4821800
Kind Code:
B2
Abstract:
A lead-free solder which is significantly less susceptible to copper leaching when used in a molten state in which coil ends of copper wire are dipped comprises 1.5-8 mass % of Cu, 0.01-2 mass % of Co, optionally 0.01-1 mass % of Ni, and a remainder of Sn and has a liquidus temperature of 420° C. or below. The solder may further comprise at least one oxidation-inhibiting element selected from the group consisting of P, Ge, and Ga in a total amount of 0.001-0.5 mass %, and/or Ag in an amount of 0.05-2 mass % as a wettability-improving element.
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Inventors:
Onishi Tsukasa
Application Number:
JP2008134508A
Publication Date:
November 24, 2011
Filing Date:
May 22, 2008
Export Citation:
Assignee:
Senju Metal Industry Co., Ltd.
International Classes:
C23C2/34; B23K1/00; B23K1/20; B23K35/26; C22C13/00; C23C2/04; C23C2/08; C23C2/38; B23K101/36; B23K103/12
Domestic Patent References:
| JP11329177A | ||||
| JP2001129682A | ||||
| JP2002222708A | ||||
| JP2001121286A | ||||
| JP2004122227A | ||||
| JP2003001482A | ||||
| JP11320177A | ||||
| JP2002307186A | ||||
| JP2001334384A |
Foreign References:
| WO2002068146A1 |
Attorney, Agent or Firm:
Shoichi Hirose