Title:
【発明の名称】半導体装置及びその製造方法
Document Type and Number:
Japanese Patent JP3093226
Kind Code:
B2
Inventors:
Tetsuo Fujii
Application Number:
JP1158490A
Publication Date:
October 03, 2000
Filing Date:
January 19, 1990
Export Citation:
Assignee:
株式会社デンソー
International Classes:
H01L29/73; H01L21/02; H01L21/331; H01L21/76; H01L21/762; H01L21/8249; H01L27/06; H01L27/12; H01L29/732; (IPC1-7): H01L21/8249; H01L21/02; H01L21/331; H01L21/762; H01L27/06; H01L27/12; H01L29/73
Domestic Patent References:
| JP6362252A | ||||
| JP58204553A | ||||
| JP1305534A | ||||
| JP63302552A |
Attorney, Agent or Firm:
Hironobu Onda (1 person outside)