Title:
【発明の名称】半導体装置
Document Type and Number:
Japanese Patent JP2504465
Kind Code:
B2
Abstract:
PURPOSE:To protect a semiconductor pellet from cracks by a method wherein the fixation of the semiconductor pellet to a substrate is accomplished by using a junction layer formed to surround the semiconductor pellet. CONSTITUTION:In a semiconductor device mounted with a semiconductor pellet 3, a junction layer 4 is formed for example of an adhesive agent, surrounding the semiconductor pellet 3 and fixing the semiconductor pellet 3 to a substrate 1. With the fixation of the semiconductor pellet 3 to the substrate 1 being accomplished by the junction layer 4 built to surround the semiconductor pellet 3, stress residual in the semiconductor pellet 3 attributable to the difference in thermal expansion factor between the semiconductor pellet 3 and the substrate 1, is rendered roughly uniform in distribution across the entirety, which prevents the semiconductor pellet 3 from cracks.
Inventors:
HIDAKA MITSUMORI
MIZUNO CHOICHIRO
MIZUNO CHOICHIRO
Application Number:
JP14306487A
Publication Date:
June 05, 1996
Filing Date:
June 10, 1987
Export Citation:
Assignee:
HITACHI LTD
International Classes:
H01L21/52; H01L23/36; H01L23/52; (IPC1-7): H01L21/52; H01L23/36
Attorney, Agent or Firm:
Akita Aki