Title:
ワークの分割方法
Document Type and Number:
Japanese Patent JP5680931
Kind Code:
B2
Abstract:
In a semiconductor wafer with a supporting tape attached to the back side of the wafer, a coating member having a refractive index close to that of the supporting tape is formed on a pear-skin surface of the supporting tape to thereby planarize the pear-skin surface. Thereafter, a pulsed laser beam is applied from the upper side of the coating member to the semiconductor wafer in the condition where the focal point of the pulsed laser beam is set at a predetermined depth in the semiconductor wafer. Accordingly, the pulsed laser beam can be sufficiently focused inside the semiconductor wafer to thereby well form a modified layer inside the semiconductor wafer.
Inventors:
古田 健次
Application Number:
JP2010227851A
Publication Date:
March 04, 2015
Filing Date:
October 07, 2010
Export Citation:
Assignee:
株式会社ディスコ
International Classes:
H01L21/301; B23K26/40; B28D5/00
Attorney, Agent or Firm:
Hiroaki Sakai