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Title:
【発明の名称】スタンプ素材およびこのスタンプ素材を用いたスタンプ作成方法並びにこのスタンプ作成方法により製造したスタンプ
Document Type and Number:
Japanese Patent JP3087308
Kind Code:
B2
Abstract:
PCT No. PCT/JP95/02373 Sec. 371 Date Nov. 12, 1996 Sec. 102(e) Date Nov. 12, 1996 PCT Filed Nov. 21, 1995 PCT Pub. No. WO96/15909 PCT Pub. Date May 30, 1996There are provided a stamp material from which a stamp can be simply made and which, in particular, permits the unexposed portion of a photoconductive resin to be easily removed in a making process, a stamp making method and a stamp. The stamp material comprises a face of a seal forming member having a photosensitive resin which is changed from a liquid to a solid in response to a received light and a stamp stock for holding the face of a seal forming member. With this arrangement, the portion of the photoconductive resin to which a light is irradiated is cured and adhered to the stamp stock and the portion thereof to which the light is not irradiated flows out or can be simply exfoliated without being cured.

Inventors:
Hiroshi Kuriyama
Youichi Kodaira
Application Number:
JP51673696A
Publication Date:
September 11, 2000
Filing Date:
November 21, 1995
Export Citation:
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Assignee:
Seiko Epson Corporation
International Classes:
B41D7/00; B41K1/00; G03F7/00; G03F7/20; (IPC1-7): B41K1/02; G03F7/00
Domestic Patent References:
JP6278350A
JP4225009A
JP585027A
JP63121849A
Attorney, Agent or Firm:
Minoru Ochiai