Title:
半導体処理装置の表面処理方法
Document Type and Number:
Japanese Patent JP5028755
Kind Code:
B2
Inventors:
Akira Tamura
Kazuya Dobashi
Kazuya Dobashi
Application Number:
JP2005183500A
Publication Date:
September 19, 2012
Filing Date:
June 23, 2005
Export Citation:
Assignee:
東京エレクトロン株式会社
International Classes:
C23C4/04; C23C16/44; C23C28/00; C23C28/04; H01L21/205; H01L21/304
Domestic Patent References:
| JP2001164354A | ||||
| JP2011768A | ||||
| JP2004023043A | ||||
| JP2002541332A | ||||
| JP2004517481A | ||||
| JP2005521250A | ||||
| JP10004083A | ||||
| JP8037180A |
Foreign References:
| WO2003080892A1 |
Attorney, Agent or Firm:
Toshio Inoue