Title:
熱可塑性樹脂組成物、それを用いた積層体およびタイヤ
Document Type and Number:
Japanese Patent JP5247537
Kind Code:
B2
Abstract:
There is provided a thermoplastic resin composition which comprises a modified rubber having excellent low-temperature durability dispersed in a polyamide resin matrix in order to improve the low-temperature durability or repeated fatigue resistance of the polyamide resin and which maintains its flowability and can be formed into a film even at a high content of the modified rubber, and has excellent low-temperature durability. The thermoplastic resin composition comprises a modified polyamide resin (A) obtained by melt blending 100 parts by weight of a polyamide resin (A1) and 0.05 to 5 parts by weight of a compound (A2) capable of binding to a terminal amino group of the polyamide resin, at a temperature equal to or higher than the melting point of the polyamide resin (A1), and a modified rubber (B) having an acid anhydride group, an epoxy group, or a carboxyl group or a derivative thereof. The compound (A2) is preferably a monofunctional epoxy compound. The film of the thermoplastic resin composition is suitably used for the manufacture of tires and hoses.
Inventors:
Naoyuki Moshioka
Application Number:
JP2009046905A
Publication Date:
July 24, 2013
Filing Date:
February 27, 2009
Export Citation:
Assignee:
THE YOKOHAMA RUBBER CO.,LTD.
International Classes:
C08L77/00; B32B25/08; B32B27/34; B60C5/14; C08L15/00; C08L23/08; C08L29/02; F16L11/04
Domestic Patent References:
JP200150434A | ||||
JP61207436A | ||||
JP2105821A | ||||
JP61502612A |
Foreign References:
WO2007083785A1 |
Attorney, Agent or Firm:
Atsushi Aoki
Takashi Ishida
Tetsuji Koga
Koji Takeuchi
Atsushi Ebiya
Takashi Ishida
Tetsuji Koga
Koji Takeuchi
Atsushi Ebiya
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