Title:
オルガノポリシロキサン及びそれを含有する熱硬化性樹脂組成物
Document Type and Number:
Japanese Patent JP6490973
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide an organopolysiloxane that forms a cured product which satisfies heat yellowing resistance, light resistance, crack resistance and transparency and can be used for optical semiconductors.SOLUTION: The present invention provides an organopolysiloxane represented by formula (1) and average composition formula (2).SELECTED DRAWING: None
Inventors:
Yuji Okada
Application Number:
JP2015015754A
Publication Date:
March 27, 2019
Filing Date:
January 29, 2015
Export Citation:
Assignee:
ASAHI KASEI KABUSHIKI KAISHA
International Classes:
C07F7/21; C08F2/44; C08F30/08; C08G77/50
Domestic Patent References:
| JP8225647A | ||||
| JP2012041381A |
Foreign References:
| WO2015012141A1 | ||||
| US20060106187 | ||||
| WO2012133432A1 |
Other References:
DEMIRCI et al.,Hybrid Organic-Inorganic Films through Crosslinking Reaction Based on Siloxane Based Polymers,ネットワークポリマー,2013年,Vol.34, No.1,pp.28-36
Attorney, Agent or Firm:
Yoshiyuki Inaba
Toshifumi Onuki
Akihiko Eguchi
Kazuhiko Naito
Toshifumi Onuki
Akihiko Eguchi
Kazuhiko Naito