THERMOSETTING RESIN COMPOSITION, PREPREG, LAMINATE, PRINTED WIRING BOARD AND SEMICONDUCTOR PACKAGE

Japanese Patent JP2017214524

A

PROBLEM TO BE SOLVED: To provide a thermosetting resin composition which has high glass transition temperature and low thermal expansion, is excellent in dielectric characteristics, solder heat resistance and storage stability, and does not need to set a press temperature at the time of prepreg lamination at 220°C or higher, and to provide a prepreg, a laminate, a printed wiring board and a semiconductor package using the thermosetting resin composition.SOLUTION: A thermosetting resin composition contains an imidazole compound (A) represented by general formula (A1) and a modified maleimide resin (B) being a reactant of a maleimide compound (b-1) having at least two N-substituted maleimide groups in one molecule and an amine compound (b-2) having at least two primary amino groups in one molecule, and contains no epoxy resin or contains an epoxy resin.SELECTED DRAWING: None

JP2015147851	RESIN COMPOSITION AND SEMICONDUCTOR DEVICE
WO/2005/118715	GAS GENERANT AND SYNTHESIS
WO/2010/048085	HIGH IMPACT POLYMERIC COMPOSITIONS AND METHODS OF MAKING AND USING SAME

TONAI SHUNSUKE
DANSEIGEN KAZUTOSHI
SHIMADA TOMOKAZU
MORITA KOJI
OHASHI KENICHI

JP2016110865A

December 07, 2017

June 02, 2016

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HITACHI CHEMICAL CO LTD

C08L39/04; C08K5/3472; C08L63/00; C08L83/04

JPH07179756A	1995-07-18
JPH06136266A	1994-05-17
JPH05247345A	1993-09-24
JPS6445463A	1989-02-17
JPH03264347A	1991-11-25
JPS62297355A	1987-12-24
JPH02222419A	1990-09-05

WO2012099133A1

2012-07-26

Tamotsu Otani
Kenichi Hirasawa
Kosuke Sawayama

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