Title:
昇降温ユニット及びこのユニットを用いた昇降温装置
Document Type and Number:
Japanese Patent JP4103997
Kind Code:
B2
Inventors:
Akira Koike
Application Number:
JP2003080255A
Publication Date:
June 18, 2008
Filing Date:
March 24, 2003
Export Citation:
Assignee:
Covalent Materials Co., Ltd.
International Classes:
H05B3/00; H05B3/44; F27B5/14; F27D11/02; F27D19/00; H05B3/12; H05B3/14; H05B3/62
Domestic Patent References:
JP56155765A | ||||
JP7142158A | ||||
JP3372515B2 | ||||
JP3079985A | ||||
JP2002009052A |
Attorney, Agent or Firm:
Kinoshita Shigeru