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Patent Searching and Data


Title:
3D PRINTING METHOD AND SYSTEM USING NEAR-INFRARED LIGHT SEMICONDUCTOR LASER AS HEATING SOURCE
Document Type and Number:
WIPO Patent Application WO/2021/204005
Kind Code:
A1
Abstract:
Provided are a 3D printing method and system that use a near-infrared light semiconductor laser as a heating source. The 3D printing system comprises a printing nozzle (4). During a 3D printing process, a laser spot is formed by outputting a laser beam by means of a near-infrared light semiconductor laser, and the laser spot is scanned to cover a relevant area of a printed material in an arbitrary path for in-situ heating so as to achieve "asynchronous" printing. The penetration depth of near-infrared light is higher than that of mid-infrared light, so that the printing method using the near-infrared light semiconductor laser as the heating source can be flexible and compatible with each printing platform. In addition, the process of laser operation in a printing system may be decoupled from a 3D printing process so as to improve the bonding strength of a multi-layer extruded filament or sintered powder interface by using a more flexible in-situ heating manner, and remove residual internal stress, low crystallinity and other mechanical defects of a part.

Inventors:
ZOU, Weizhi (CN)
XU, Jian (CN)
ZHANG, Zhiyan (CN)
GAO, Yan (CN)
LIN, Xuechun (CN)
ZHAO, Ning (CN)
Application Number:
PCT/CN2021/083619
Publication Date:
October 14, 2021
Filing Date:
March 29, 2021
Export Citation:
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Assignee:
INSTITUTE OF CHEMISTRY, CHINESE ACADEMY OF SCIENCES (CN)
International Classes:
B29C64/295; B29C64/135; B33Y10/00; H01S5/00
Attorney, Agent or Firm:
BEIJING ORIGINTELLIGENCE IP LAW FIRM (CN)
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