Title:
ACID GROUP-CONTAINING (METH)ACRYLATE RESIN, CURABLE RESIN COMPOSITION, CURED PRODUCT, INSULATING MATERIAL, RESIN MATERIAL FOR SOLDER RESISTS, AND RESIST MEMBER
Document Type and Number:
WIPO Patent Application WO/2020/129666
Kind Code:
A1
Abstract:
The present invention provides: an acid group-containing (meth)acrylate resin that is characterized by including at least one amide bond, at least one imide bond, at least one ester bond, at least one (meth)acryloyl group, and at least one acid group; a curable resin composition; a cured product; an insulating material; a resin material for solder resists; and a resist member. The acid group-containing (meth)acrylate resin can form a cured product that has an excellent heat resistance.
Inventors:
YAMADA SHUNSUKE (JP)
NAKAMURA YUMIKO (JP)
KAMEYAMA HIROFUMI (JP)
NAKAMURA YUMIKO (JP)
KAMEYAMA HIROFUMI (JP)
Application Number:
PCT/JP2019/047582
Publication Date:
June 25, 2020
Filing Date:
December 05, 2019
Export Citation:
Assignee:
DAINIPPON INK & CHEMICALS (JP)
International Classes:
C08F299/00; C08G73/14
Domestic Patent References:
| WO2018230144A1 | 2018-12-20 | |||
| WO2018230428A1 | 2018-12-20 |
Foreign References:
| JP2000344889A | 2000-12-12 | |||
| JP2015155500A | 2015-08-27 |
Attorney, Agent or Firm:
OGAWA Shinji (JP)
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