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Title:
ACTINIC-RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM, METHOD FOR FORMING PATTERN, AND METHOD FOR PRODUCING ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/129683
Kind Code:
A1
Abstract:
The present invention provides: an actinic-ray-sensitive or radiation-sensitive resin composition comprising a resin having a repeating unit represented by general formula (P1) and a compound which, upon irradiation with actinic rays or radiation, generates an acid having a pKa of -1.40 or greater; a resist film obtained from the composition; a method for forming a pattern; and a method for producing an electronic device. Mp represents a single bond or a divalent linking group. Lp represents a divalent linking group. Xp represents O, S, or NRN1, where RN1 represents a monovalent organic group. Rp represents a monovalent organic group.

Inventors:
ASAKAWA DAISUKE (JP)
KAWASHIMA TAKASHI (JP)
GOTO AKIYOSHI (JP)
SHIRAKAWA MICHIHIRO (JP)
YAMAMOTO KEI (JP)
Application Number:
PCT/JP2019/047718
Publication Date:
June 25, 2020
Filing Date:
December 05, 2019
Export Citation:
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Assignee:
FUJIFILM CORP (JP)
International Classes:
C08F12/24; C08F20/10; C08F20/58; C08F28/02; G03F7/004; G03F7/038; G03F7/039
Domestic Patent References:
WO2018116916A12018-06-28
Foreign References:
JP2006091579A2006-04-06
JP2014174428A2014-09-22
JP2011100089A2011-05-19
JP2012078723A2012-04-19
JP2012255845A2012-12-27
Attorney, Agent or Firm:
KOH-EI PATENT FIRM, P.C. (JP)
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