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Title:
ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, PATTERN FORMATION METHOD, RESIST FILM, AND ELECTRONIC DEVICE PRODUCTION METHOD
Document Type and Number:
WIPO Patent Application WO/2021/039244
Kind Code:
A1
Abstract:
Provided is an actinic ray-sensitive or radiation-sensitive resin composition with which a pattern having excellent LWR performance can be obtained even when the composition has been stored for a long period of time. Also provided are a resist film, a pattern formation method, and an electronic device production method that involve the actinic ray-sensitive or radiation-sensitive resin composition. This actinic ray-sensitive or radiation-sensitive resin composition contains an acid-decomposable resin and a specific compound, wherein the specific compound has two or more cationic moieties, and an equal number of anionic moieties as the cationic moieties, and at least one of the cationic moieties has a group represented by general formula (I).

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Inventors:
KOJIMA MASAFUMI (JP)
USHIYAMA AINA (JP)
GOTO AKIYOSHI (JP)
SHIRAKAWA MICHIHIRO (JP)
KATO KEITA (JP)
MARUMO KAZUHIRO (JP)
OKA HIRONORI (JP)
Application Number:
PCT/JP2020/028844
Publication Date:
March 04, 2021
Filing Date:
July 28, 2020
Export Citation:
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Assignee:
FUJIFILM CORP (JP)
International Classes:
C07C309/06; C07C309/12; C07C309/17; C07C311/14; C07C311/48; C07C311/51; C07C381/12; G03F7/004; G03F7/038; G03F7/039; G03F7/20
Domestic Patent References:
WO2019138953A12019-07-18
Foreign References:
JP2005275153A2005-10-06
JP2012008369A2012-01-12
JP2019008277A2019-01-17
JP2014010245A2014-01-20
JP2019045864A2019-03-22
US20160070167A12016-03-10
US20150004544A12015-01-01
US20160237190A12016-08-18
JP2014041328A2014-03-06
JP2014134686A2014-07-24
JP2013011833A2013-01-17
JP2018155788A2018-10-04
JP2011248019A2011-12-08
JP2010175859A2010-08-12
JP2012032544A2012-02-16
US20080248425A12008-10-09
JP2002090991A2002-03-27
JP2014059543A2014-04-03
JP2013061648A2013-04-04
JP2009267112A2009-11-12
Other References:
JOURNAL OF THE INTERNATIONAL SOCIETY FOR OPTICAL ENGINEERING (PROC. OF SPIE, vol. 6924, 2008
"Semiconductor Process Text Book", 2007, SEMI JAPAN, article "Chapter 4 Etching"
Attorney, Agent or Firm:
NAKASHIMA Junko et al. (JP)
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