Title:
ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE FILM, METHOD FOR FORMING PATTERN, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/172112
Kind Code:
A1
Abstract:
The present invention provides: an actinic ray-sensitive or radiation-sensitive resin composition, represented by specific general formula (1), containing (A) a resin, and (B) a compound that produces an acid when irradiated with actinic rays or radiation; an actinic ray-sensitive or radiation-sensitive film formed by the actinic ray-sensitive or radiation-sensitive resin composition; a method for forming a pattern; and a method for manufacturing an electronic device.
Inventors:
HATAKEYAMA NAOYA (JP)
FUKUZAKI EIJI (JP)
YOSHINO FUMIHIRO (JP)
FUKUZAKI EIJI (JP)
YOSHINO FUMIHIRO (JP)
Application Number:
PCT/JP2021/005776
Publication Date:
September 02, 2021
Filing Date:
February 16, 2021
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
C07C309/08; C07C309/04; C07C309/12; C07C309/17; C07C309/19; C07C311/02; C07C313/04; C07D277/32; C07D279/10; C07D327/02; C07D327/04; C07D327/06; C07D327/10; C07D339/00; C07D339/08; C09K3/00; G03F7/004; G03F7/038; G03F7/039; G03F7/20
Foreign References:
| JP2014048500A | 2014-03-17 | |||
| JP2014199389A | 2014-10-23 |
Attorney, Agent or Firm:
KOH-EI PATENT FIRM, P.C. (JP)
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