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Patent Searching and Data


Title:
ACTIVE-LIGHT-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM, PATTERN FORMATION METHOD, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/129476
Kind Code:
A1
Abstract:
Provided are: an active-light-sensitive or radiation-sensitive resin composition with outstanding sensitivity and electroluminescence (EL) when an ultrafine pattern (e.g., a line-and-space pattern with a line width of 45 nm or a hole pattern with a hole size of 45 nm or less) is being formed, low line-width roughness (LWR) and line-edge roughness (LER), and outstanding critical dimension uniformity (CDU); and a resist film, a pattern formation method, and a method for manufacturing an electronic device utilizing the composition. The active-light-sensitive or radiation sensitive resin composition contains a resin with a repeating unit represented by general formula (P1) in a content ratio of 30% by mass relative to the entire solid content and a cross-linking agent in a content ratio of 10% by mass relative to the entire solid content. The resist film, the pattern formation method, and the method for manufacturing an electronic device utilize the active-light-sensitive or radiation-sensitive resin composition.

Inventors:
ASAKAWA DAISUKE (JP)
KAWASHIMA TAKASHI (JP)
GOTO AKIYOSHI (JP)
YAMAMOTO KEI (JP)
SHIRAKAWA MICHIHIRO (JP)
Application Number:
PCT/JP2019/044524
Publication Date:
June 25, 2020
Filing Date:
November 13, 2019
Export Citation:
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Assignee:
FUJIFILM CORP (JP)
International Classes:
C08F20/10; C08F12/24; C08F20/58; C08F28/02; G03F7/004; G03F7/038; G03F7/039
Foreign References:
JP2015087644A2015-05-07
JP2004280049A2004-10-07
JP2016206459A2016-12-08
JP2016218202A2016-12-22
JP2017119678A2017-07-06
JP2009192784A2009-08-27
JP2000267287A2000-09-29
Attorney, Agent or Firm:
NAKASHIMA Junko et al. (JP)
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