Title:
ACTIVE LIGHT SENSITIVE OR RADIATION SENSITIVE RESIN COMPOSITION, ACTIVE LIGHT SENSITIVE OR RADIATION SENSITIVE FILM, PATTERN FORMING METHOD, AND METHOD FOR PRODUCING ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/065450
Kind Code:
A1
Abstract:
An active light sensitive or radiation sensitive resin composition which contains (A) an acid-decomposable resin, (B) a compound represented by general formula (b1), and (C) a compound represented by general formula (c1), wherein the ratio of the content of the compound (C) to the content of the compound (B) is from 0.01% by mass to 10% by mass; an active light sensitive or radiation sensitive film which uses this active light sensitive or radiation sensitive resin composition; a pattern forming method; and a method for producing an electronic device. In the formulae, L1 represents a single bond or a divalent linking group; A represents a group that is decomposed by the action of an acid; each B represents a group that is decomposed by the action of an acid, a hydroxy group or a carboxy group, provided that at least one B represents a hydroxy group or a carboxy group; n represents an integer from 1 or 5; X represents an (n+1)-valent linking group; and M+ represents a sulfonium ion or an iodonium ion.
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Inventors:
MIYOSHI TARO (JP)
YONEKUTA YASUNORI (JP)
FUKUZAKI EIJI (JP)
TAKAHASHI TOSHIYA (JP)
YONEKUTA YASUNORI (JP)
FUKUZAKI EIJI (JP)
TAKAHASHI TOSHIYA (JP)
Application Number:
PCT/JP2020/034762
Publication Date:
April 08, 2021
Filing Date:
September 14, 2020
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
C07C25/02; C07C43/225; C07C309/12; C07C309/22; C07C309/42; C07C309/58; C07C381/12; C08F12/24; C08F20/16; C08F20/58; C09K3/00; G03F7/004; G03F7/039; G03F7/20
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See also references of EP 4039669A4
ELMAR PLATZGUMMERSTEFAN CERNUSCACHRISTOF KLEINJAN KLIKOVITSSAMUEL KVASNICAHANS LOESCHNER: "eMET - 50 keV electron Mask Exposure Tool Development based on proven multi-beam projection technology", PROC. SPIE, vol. 7823, 2010, pages 782308, XP055099481, DOI: 10.1117/12.864261
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See also references of EP 4039669A4
Attorney, Agent or Firm:
KOH-EI PATENT FIRM, P.C. (JP)
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