Title:
ACTIVE-RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM, METOHD FOR FORMING PATTERN, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/187445
Kind Code:
A1
Abstract:
Provided are: an active-ray-sensitive or radiation-sensitive resin composition which can be prevented from the change in line width of a pattern due to post-exposure delay; a resist film using the active-ray-sensitive or radiation-sensitive resin composition; a method for forming a pattern; and a method for manufacturing an electronic device. The active-ray-sensitive or radiation-sensitive resin composition comprises: a resin A having a repeating unit that has an acid-degradable group in which a polar group is protected by a protection group capable of being detached by the action of an acid; and a compound represented by general formula (1).
Inventors:
YAGI KAZUNARI (JP)
GOTO AKIYOSHI (JP)
KAWASHIMA TAKASHI (JP)
GOTO AKIYOSHI (JP)
KAWASHIMA TAKASHI (JP)
Application Number:
PCT/JP2018/048093
Publication Date:
October 03, 2019
Filing Date:
December 27, 2018
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
G03F7/004; C07C59/60; C07C309/57; C07C317/44; C07C321/28; C07C381/12; G03F7/038; G03F7/039; G03F7/20
Foreign References:
| JP2014177449A | 2014-09-25 | |||
| JP2013167731A | 2013-08-29 | |||
| JP2009244805A | 2009-10-22 | |||
| JP2017197489A | 2017-11-02 | |||
| JP6255499B2 | 2017-12-27 |
Attorney, Agent or Firm:
NAKASHIMA Junko et al. (JP)
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