Title:
ACTIVE-RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM, PATTERN FORMATION METHOD, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, AND RESIN
Document Type and Number:
WIPO Patent Application WO/2020/008734
Kind Code:
A1
Abstract:
Provided is an active-ray-sensitive or radiation-sensitive resin composition having excellent exposure latitude. Also provided are: a resist film using the active-ray-sensitive or radiation-sensitive resin composition; a pattern formation method; and a method for manufacturing an electronic device. Also provided is a novel resin. The active-ray-sensitive or radiation-sensitive resin composition includes a resin that includes the repeating unit represented in formula (1), the polarity of the resin increasing due to the effect of an acid.
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Inventors:
ASAKAWA DAISUKE (JP)
GOTO AKIYOSHI (JP)
KOJIMA MASAFUMI (JP)
KAWASHIMA TAKASHI (JP)
OISHI YASUFUMI (JP)
KATO KEITA (JP)
GOTO AKIYOSHI (JP)
KOJIMA MASAFUMI (JP)
KAWASHIMA TAKASHI (JP)
OISHI YASUFUMI (JP)
KATO KEITA (JP)
Application Number:
PCT/JP2019/019333
Publication Date:
January 09, 2020
Filing Date:
May 15, 2019
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
G03F7/039; C08F26/06; G03F7/038; G03F7/20
Domestic Patent References:
| WO2013047536A1 | 2013-04-04 | |||
| WO2018193954A1 | 2018-10-25 |
Foreign References:
| JP2017058421A | 2017-03-23 | |||
| JP2003122012A | 2003-04-25 |
Attorney, Agent or Firm:
NAKASHIMA Junko et al. (JP)
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