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Title:
ACTIVE-RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTIVE-RAY-SENSITIVE OR RADIATION-SENSITIVE FILM, PATTERN FORMATION METHOD, AND ELECTRONIC DEVICE MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2021/039654
Kind Code:
A1
Abstract:
The present invention provides: an active-ray-sensitive or radiation-sensitive resin composition having a solid material concentration of 10% by mass or more, the active-ray-sensitive or radiation-sensitive resin composition comprising a resin (A), a photo-acid generator (B-1), a photo-acid generator (B-2), and an acid diffusion controlling agent (D), wherein an acid generated from the photo-acid generator (B-1) has a pKa value of less than 0, an acid generated from the photo-acid generator (B-2) has a larger pKa value than that of the acid generated from the photo-acid generator (B-1), and the content of the photo-acid generator (B-2) is 0.001 to 0.10% by mass inclusive relative to the content of the photo-acid generator (B-1); an active-ray-sensitive or radiation-sensitive film formed from the active-ray-sensitive or radiation-sensitive resin composition; and a pattern formation method and an electronic device manufacturing method each using the active-ray-sensitive or radiation-sensitive resin composition.

Inventors:
YONEKUTA YASUNORI (JP)
HATAKEYAMA NAOYA (JP)
TSUBAKI HIDEAKI (JP)
TOMIGA TAKAMITSU (JP)
HIGASHI KOHEI (JP)
Application Number:
PCT/JP2020/031693
Publication Date:
March 04, 2021
Filing Date:
August 21, 2020
Export Citation:
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Assignee:
FUJIFILM CORP (JP)
International Classes:
C07C63/04; C07C69/06; C07C309/12; C07C309/17; C07C381/12; C07D211/16; C07D211/46; C07D217/08; C07D327/06; C07D333/46; C07D335/02; C08F12/24; C09K3/00; G03F7/004; G03F7/039; G03F7/20
Foreign References:
JP2015194715A2015-11-05
JP2016148740A2016-08-18
JP2018049177A2018-03-29
JP2016133733A2016-07-25
Attorney, Agent or Firm:
KOH-EI PATENT FIRM, P.C. (JP)
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