ADPi iVE; B»CESSiNG O FL ORQF L¥MlKS

Field

'the present disclosure relates to :addi{!¾::proeessin ^, of flaoropoiyrners. to fi Oropolyrrter articles- obtained hy additive processing, and to: fB ropolymer feeiniJosit o s useful for additive processing. Background

in particular for articles requiring low friction properties nd /or inertness to chemical reactivity, heat, or both.

Pluoropoiymers are typicall classified into thermoplastics and elastomers (sometimes also conventional melt sh ing _; methods, such as injection molding and extrusion..Fluorothermop!astics typicall are copolymers of - ^: tetrafluor ethy)ene (TFE) with on© or more other -perRuoi mated, partially fluoridated: or notviluorinate comanomers _* Copolymers of TFE and perflyorinated alkyj or ally! ethers are krsown in the art a PFA's (perfluoiiriaied alfcoxy ol mery). Copolymers of TFE and hexafluoropropylene {FiFF) with or withou other perflisorinated comonomers are knows in the art as FEP's (iluorinated ethylene propylene); Copolymers of TFE, HFP and vinyOdenefliioride (VIM?) are known in the art as ΤΙ-Γν', Other types of mel -processa te

fliioropoSymers are based on vinylideneftubride homo- or copolymers, known in the art as P VDF.

Copolymers of TFE and ethylene are known as ETFE.

Certain types of thermoplastics, have, a very h igh melt viscosity (low melt flow -index- (MF!) and are termed in the art as "non-melt proeessable". Non-melt proeessable ftuoropojyme ^' rs- include hoiiiopolymefs of TFE or copolymers of TFE with other eopolymerizable perfiHOrinated monomers, wherein the amount of comonoraers is limited to less than 1 %wt, Such TFE horao-and copolymers arc referred to in the art as PTfl. PTFE has such a high melt viscosit that i cannot be processed by corrventlonai melt processing -techni ues such as extri R n injection molding or blow molding. Instead PTFE articles typical iy are produced -by paste extrusion, or fay sintering to produce blocks, o billets which are then shaped into articles, For example by skiving, turning, machining (i.e., stsbsiraetive methods- where materia! is removed to shape articles).

In WO2Q07/133912 A2 m additive manufacturing process j¾r special thermoplastic

nuorepoiymers (PVPf arid PCTf) are described but examples are not provided. In GN i 0370 7 7 A and CN 1 571 Π 04: A methods for 3D printing are described where the use of PTFE is mentioned. The materials are processed ½ irradiating a polymer powder with infrared or lasers and melting the powder in selected areas exposed to the IR- or laser irradiation:. These, methods are known in the art of 3D-prmiing. as laser melting or laser sintering, in US 7,569,273 82 a dlffeie:nt.method.- described that is; reported to be.:saitabtefbr P¥O Examples are. als© ^: not provided. ^' The method described in US -7,Si>¾273 involves adding a i¾ :ihro«gh a ozzle to a solid composition coraprisirig the polymcr andiar! adhesive _: particulate ..material. The arise ulate materia! be omes: . ^' adhesive, upon contact: with the fluid and thus is reported to create an article by distributing the fluid on selected areas.

There is a need for providing alternative methods of processing fluoropoiymers ^" : additive processing an iti partie«.!arihere is. a need for processing flooropoiyiriers. of the non-melt :pt¾ccssible type.

Summary

In one aspect there is provided a method of pr duehi a flm> Opaiyn-re article comprising;

subjecting a composition comprising flitoropaSymer particles and a binder ma.teria! to additive processing in an _. additiv processing device containing at least one ener y source and ^" wherein the iluoropolymer is a homopolymer or copolymer of tetfaiTyoroeihy1:ene :(TFE;) and wherein t re binder material is capable: of binding the flooropoiyfrser partfeies to form a layer in a part of the composition that has been, exposed to the energy source of the additive processing device and the method further comprises subjecting a pari of the. composition to exposure of the energy source to. form a iayer.

In another aspect there is provided a composition for producing an article by additive processing in art additive processing device comprising- fltroropolynier particles, optionally, one or more filler, and a _: binder material; wherein the fluorapolyiner ¾.a homopolyjrier or copolymer of tetratluorosthyiene (TFE) .arid wherein the; binder material comprises an organic material having carbon-carbon bonds and carbon- h drogen bonds and melts, between 40°C and ! 40 ^P C.

in a further aspect, a iD-printed fltiorepo ^' lymer is provided that is obtainabl by the. above method.

1 n yet another aspect the e: is provided an article com prising a 3D-printed flooropolyrner obtainable by the above method.

Detailed Description'

The present Applicants have observed that itfe diffietiit to create fluoropolymer articles, having a complex design with the traditional methods.. Shaping articles by removing excess fluoiOpoiymer (for example through skiving or die cutting) wastes expensive fluoropolymer material Articles produced by injection molding are less wasteful, however the construction of molds can he expeitsive and time consuming. Rapid prototyping toidentify optimized article designs by ¾^itio.n.al ^' et o ^' d¾1herefoi¾. _> - ^' Cti¾i- be .economical !y impractical ,

Therefore, there is a need to provide alternative production methods for producing. fluoropoiyrtier articles.

Before any embodiments of this disclosure are explained. in detail, ft is to be understood hat the disclosure -is no tintitedin its application to the detail s of construetipn aod t ie arrangetrieni of components set forth in ihe following: description. Also, it is to be understood that the phraseology iand terminology used herein is for the purpose of description. Contrary to die use of "consisting^ -the use of "including," "containing", . "com rising * or "having" and variations thereof is meant io encompass the items listed thereafter and equivalents thereof :as: well as additional items. The use- oP ⁵ * ^' ©T.^an" is meant 1 io encompass "one or more ^" . Any nuriisrieal rang© recited herein is intended to neiude ail yaiues front the lower value to tlte upper value, of that range. ar exam le* a concentration range of from 1 % to 50% is .in-tended to he an abbreviation and to expressly dssciose- the valises- between the 1% and 50%, such as, for example, 2%, 49%, 10%, 3i>%, 1 ,5 ¾.. 3.9 % aftd so forth.

Ail references cited herein are incorporated, by reference unless stated otherwise..

AS s o other sciendfie norms referred :to herein are those thai ¾¾re active Λ the time of filing the earliest priorit application if the year is not specified. If at t he time of the earliest priority filin the ASTiVl or oilier norm was not active anymore, than the most recent active version is referred to.

The present Applicants have found that fmoropolyn f articles ^' cars be prepared by additive processing. The fluoropoiyTsers are provided as a coniposition bat is suitable for additive processing and can then be processed into a three imenskmai article by additive processing, typically, in an additive processing device. Various known, additive processing; techniques may be used and also various known additive processing devices or 3D printers may be, used. Such 3D printable compositions .contain the fluoropoiymers and additional materia! that is capable of h inding 11 uoropolyniser particles into a volume element or a layer by melting or iiquefying npon the .raateriai bein exposed to an energy source, typically the energy source of the additive processing device. "Lis[uefying" as Used to ero means that the: material significantly reduces its viscosity and becomes fipwabfe.- h is believed that the molten or liquefied material may embed or encapsulate the lluoropolyme - particles and/or binds them and thus keeps them, in the selected location. Such one or more additional- materials-are therefore also referred herein: as "binde ^' material";

Fkioropaiymer containing layers may be created .successi ely to form a three-dimensional object. After the creation of the article i the additive processing device the .-additional material may be removed, typically by heat treatment which may include degradation or combustion. This step may be followed by Other work-up steps, which may include,, for example, sintering the article.

An advantage of the methods: provided herein is that not only prototypes of ilnoropolymer articles can be produced at low costs but also fluoropoiymer articfesof complex shape and design may be created that may not be available: through conventional fluoropoiymer processiiig or only at higher costs.

The- methods provided herein are also less wastefu l because -unreacted 3D printable compositions may be reused in a next 3D print run.

Additive processing

Additive oeessin g. also known as "3 D : printing or "additiv manufacturing (AM refers to a process-to _. create a- three-dimensional object by seq ential deposition or formation of materials in defined areas, typically by generating successive layers of material. The object is typically produced under computer control from a 3D model or other electronic data source by an additive printing device typicall referred to as a.3D printer. The term "3D printer* and: ''additive processing device" are used herein interchangeably and generally refer ^" to. a d ev ice by which additive pfoeessmg can be carried out. The terms "3 D-printin _. g" and "3D-printabie ^'! are vised Itice ise and: mean additive processing arid suitable for additive processing, Addith'e; processing devices are devices by which sequential deposition or o ion of material

5 based on an electronic image of the object to be created. The 3D printer contains an energy source that- applies energy to a localised area in a 3D-priniabie composition:. The energy applied may be, for example, heat or irradiation or both. The energy source may include a liglit source, a laser, e-beam genenttca's, heat generators: and ether sourelng sapabie of ^: foeuss½g energy to defined areas of the :3:B-prtutahfe composition. The energy sou ce may be moved to defined areas over ibe surface of the 3D printable i0 composition, typically under computer control

The additive processing device typically also contains a platform mat can be moved into the S D- printabSe composklon or out ef.it, typically, by the distance of the iayerslo be formed on me platform. Typically this is also done uader computer control The device may farther contain a device such as a wiper Hade or an injection no-izfe by which ne printable material can.be applied over the layer formed Ϊ5 for successive !ayer-omiayer building. Support structures may be used and later removed in case the object to be created is complex or requires structural support during its creation.

Ad:d its e processing techniques are kno n, O yects can he created from liquid 3D printable compositions or solid ID-printable compositions depending on the additive processing method and device: used.

20 In one embodiment of the present disclosure the layers are created from a solid composition. The

3D prsntable ^■ 'Composition ^' is typically provided in the form of partictes fbr example in the form of a powder, or in case of the filament deposition process, in the form of an extmdate, for example extruded into ^' filaments. The tluoropolymer and the binder material may be present as particles or the

fS uoropolymer particles may be coated with the binder material The fluoro ^' polymer particles are fused

25 selectively b bringing the binder material to the melt (or liquefying it) using an energy source, typically a heat source. Depending on th melting temperature of the binder material a high or low heat source may be used A laser may be used hi case of selective layer sintering (SLS) or .selective layer melting (SL ), or .an electron beam in ease of electron beam melting fEB ). If lower temperatures a e sufficient for the formation o vdlu _. me elements through melting or liquefying, heated wires and thermal print heads may

30 be used (also r-eterred. to as "thermal printing"). Typically decomposition or melting of the ftuoropotymef should be avoided and the energy source should be chosen accordingly. Processes may include one o more thermal sources Tor Inducing fusion between powder particles by the binder material, a method fo controlling powder fusion, to a prescribed region of each layefj and a mechanisms for adding and

-smoothing, powder layers or removing, powder layers, Fusion mechanisms can include but are not limited ai. to mechanisms based on .adhesion or prQV.idi«g a physical barriers, for exan^le by encapsulation or

..combinations thereof.

Some of the disclosed method use an energy source to fuse pattlelss tinto. a mass that ..has a _: desired three-dimensional shape. The. focused energy source selectively fuses powdered material by scanning cross-sections generated from a 3-D digital description of the part (ibr example from CAD fi or scan data) on the surface of a powder beet, After each ©fos-s-section is scanned, the powder bed is ^' lowered: (or ^ rai ed depending n the desigrrof the 3D: printer ) by one; layer ttrie.kness, a ne layer of material is applied ^: on:;top _5: and: the p ocess is repeated until the part Is complete. In selective laser sintering. (SLS) or me n-g (Sf ), typieally a pulsed laser is used and in IBM an electron beam is used, in 3 D thermal printing a heated w or a: thermal print head or other heat sources may be :«sed. The heat may fee generated fo example,,, by electricity or irradiation or other appropriate^ means Of genei-ating increased temperatures, In the process of the present disclosure the binder ^■ .materia:! melts or ^■ liquefies upon exposure to the energy source thus binding (or ^' "fusing") the fluoropoly ^' iner particles into a volume element,

The processing device may preheat the bulk: p<«der material iti the powder bed somewhat below'

other than a laser Is bringing about the particl fusion.

The additive manufacturing method for producing as article by these methods may typically comprise:

(i) providing a composition comprising a 3D printable, lluoropolyrner composition

comprising iTuoropoiymer particles and binder material and optionally other ingredients;

(it) causing the binder to melt or to liquefy and to bind fluoropolymer. astictes by either (a): directing energy from the energy -source of tbe additive nianutacturing dewce to a selected location of the 3D printable composition and causing the- binder material to melt or to. liquefy .and to bind fluoropoSyme particles iti the selected location; or (h): directing a selected location of the 3D printable composition to the energy source and causing the binder material to melt Or to liquefy and to bind ftuoropoSymer particles, or a eonibination of fa) and (b);

{in). directing either (c) the energy source away from the 3D printable composition, or vice- versa (d) directing the 3D printable corn-position sway from the energy source or both to avoid; ^"' the hinder materia! to bind. fJuoropolysier particles in the non-selected locations, or a combination of ^' (c) and id):

(iv) repeating. steps (is.) and (Hi), ^' and if necessary also step (i), to.ioim -multiple layers and create an article. If necessary new 3D printable compositions can be added or tmreacsed material ma be emoved after steps (Ϊ i), and/or (si i),

^' The heat source can be selected as described above an is chosen to be compatible with the ingredients of the- 3D printabie composttiorf.

The 3D printable com sitions for these processes typically comprise. a solid composition of fiuotopoiymer particles and binder materia! particles, or a composition of fluoropolymei- particles coated, with hinder material or a combination thereof preferably solid composition. Preferably, the

other ingredients as described herein, preferably solid ingredients. The 0upropp.{ymers,. binde ^■ .material ^' s md csther ingredients ean. be used as described herein.

Di ected energy deposition (DE0) processes deposit material that is molten or comprises moKeh bi nder material or is eon verted into _: a flowahl© or exirudabie■ material through one or more de osition devices, exa ple extursJor! nozs es. These ^' .methods rs.se or¾e or ipore energy sotwee to process the 3D printable composition through the . deposition device DED processes enable the creation of bed, s a focused heat source, a laser or electron beam may be used; or heat: generated by extrusion^ for example as? extrusion device or a component of att extrusi n device may be sufficient for this purpose, The extrusion device or the component thereof may be heated and flie composition may be preheated before 'entering the extrusion device, in extrusion-layered deposition■ systems (e.g. fused filament f&brieaiib ^' n systems and othe melt+extntsion. additive manufeetiuirig processes) articles are - produced iayer^by-layer by extrudmg a 3D-pri ahle compositio through an extras ion head, Movement of the extrusion head with respect to the substrate onto which the substrate is extruded, is performed under eomputer control, in accordance with the build data that represents the artieSe, for example a CAD file. The composition can be extruded through a nozzle carried by an extrusion head and deposited as a sequence of roads oa a s bstra in an .x-y pl ane. The roads can be in the form of continuous beads or the form of a series of droplets (e.g. as described, for .example in US Patent Application o

20 i 3/0:081599). The extruded composition roses to previously deposited composition it solidifies upon a drop iu temperature. This can provide at least a portion of the first layer of the ^' three-dimensional article. By changing the position of the extrusion head relative to the first layer additional rows can be repeated ly build. This 3D-printing method is also known under the term "fused deposition modelling or "PDM:"> The compositions provided herein may also be used i FD ^ In which case they are formulated such that they can be extruded, for exampl as extnidable solid compositions or as extrudable pastes. The binder i perial typically melts during the extrusion process and the composition is deposited On selected locations where the molten binder material rsiay solidify and thus binds the tluoropoiyiTier particles.

The additi e manufacturing method for producing .an article by these deposition methods ma typically comprise

(Ϊ) ^' roviding an ex mdabte composition comprising a 3D printable fluoropo!yme

composition comprising Ouoropolymer particles and the binder material and optionally other mgredientsi.

(ii) extruding the composition to a selected location wherein the. binder material has, been molten or liquefied by the energy source of the device to bind the nuoropolyiner particles,.

(iii) repeating .step (ii) arid if necessary also ste (i) to form stu tiple layers and create an artiele.. The heat source can be selected as -described above and a be adapteij to . ^' the binder material and other ingredients present in the 3D printable composition. ypically the heat source is an extruder or a component, of il extruder, or f¾r example the no.zzie i.asi extrusion head; The extruder w. at leasi o e; of its components: may he heated , ^' the composition i$ _: . preferably extruded through- sn extrusion n zzl pf 5 a : ^' he¾ted:. extruder bead.

e inidahle 30 printable '.composition, lor example a paste or a- solid exlrudate such as- filahie s or pellets. The filaments or pellets may then be heated and extruded again in. the.30 printer,

The extrudabie composition may comprise the fluoropotymer particles ^' and binder te ia] JO particles, or comprise the iliioropolymer particles coated with binder material, or a combinatio thereof.

The com ositions may .also contain other ingredients: as ^■ described herein, preferably solid ingredients. The fliiOropOlysBers, binder mate-rials and: other ingredients can. be used as described herein.

Dependin on the complexity of the article design supporting sirBctures may be attached to the elevator platform, to pre vent deflection or deiaininaf ion due to gravity and to . hold cross sections in" place ! S in order to resist lateral pre$SH re f m any mec an ioal spread ing dev ice.

The -met ods provided herein can be carried out in the respective known and commercially- available additive. rinting devices. Typical known methods and their 3D printer have been described, for example, in "Additive Processing of Polymers" by B. endel et a i rosia/. Matter. Eng. 20¾8, 293, 799-809. Examples of commerciall available 3D printers ^' include,; but are." not limited to 3D printers from 8 BLUEPii.lNT.ER, Copenhagen, Denmark for powdered bed printing with thermal heads, Printers for filament extrusion fFDM) are available, for example, from Stratasys Direct Inc., Valencia, CA 91353, for example model Makerhot Replicator 2. fluoropolymers

5 The f!uoropo!ymers lor use in the present disclosure contain repeating units derived from

flaorinated or per liiorsnated oiefinie monomers and preferably perfluorirsaied olefin ic moiiomers, more preferably exclusively of pertluorinate oleirme monomers-.

Suitable ftioropolymers for isse in the addi ive processing _. methods provided herei are thermoplastic f aoropolymers (fluorotherraopfestics) inekiding ths non-melt pr cessahle lluoropol mers. 0 The lliiorop-olymers can be conveniently prepared by aqueous enudsioh polynierizitf ion as described for example, in US 2,434,058, US 2.9(55,595 and EP 003 063 A2, EP 0 969 027. Alternatively,

fluoropolymers may be prepared by solvent polymerization including organic solvents and inorganic: solvents like li uid COj or by suspension polymerization. Suspension polymerization may be carried out in aqueous media withem using eroulsifes,

35

FSuorothermopiastics

Suitable fiuomthernioplastics include copolymers of TFE and one o more perflworinated, partiall -.fl-uOi-mated or non-fluorinated eomonomers. The comonomer eonieat is typicaliy greater than 1 % wt, preferably greater than 2%,wt a ^' may be up to 30% wt, jas ys d; hereinabove and felow the wei ght: ercenta es- are based on total we ight of the poiyra er - unless speeii ed: otherwise). Examples include: FEP (copolymers, of TFE, RFP and Other optional amounts of peril drinated viny) ethers); THV ^: (copolymers of TFE, VDF and HEP) _¾ PFA (copolymers of TFE a d per ltiofOa!liyivitwletliefi) and .cop lymers, of TPE and ethylene (ETFFJ. Thermoplastic rluoropolyine s een be prepared or obtained: as described, for example, in 'Tlworopoiynver. Organic" in Lillmann's Encyclopedia of IndtiStrsaFGheniistty, 7 ^l!l edition, 2013, s!ey-VCfrVeriag Chemie, Weinheim, Germany,

Prefen-edifliiorothermopiasties ineksde tluorop iymers with a melting point between 26Q and 31 *C. Other preferred fiuorathennoplasties: inelude those, ith a elt flow indexf Fl) at":372°C- and 5kg loadfMPl 372/5.) .From I to ^■ SO g ί θ min, or (torn more than 0J to 50,g/ l O irk

In one embodiment the iliiorofhermopSasUcs are PFAs. PFAs are copolymers of TFE and at least one perfUioro a!ky! vinyl ether (PAVEs), perfiuoro alkyiallyl ether (PAAEs) and combinations thereof asd may o may not contain additional perfluorinated eomonome.rs. Typical amounts of copolymers range front 1 .7 ¾ to 10%. wt. Preferably, the PFAs have a melting; point between: } SO °C and 3 i.5°e, for example between 180 to 280*0, or between 200 and 300°C,

Perfluorinated . vinyl ethers (PAVEs) and a!iyl ethers (PAAEs) may have oxygen atoms in their perSliioroalkyl chain (such chains- .may also be refeired O ^' as ^' -^fi ^: ofm!kylethe ^or ^: ^rfltto½a loxy chains). Typical examples of PAVEs . include but are not limited to psrflnof methyf vinyFether (F VE),, peril Doropropyl vinyl ethers (PPVEs) and alkoxy vinyl ethers inciiiding those of the general formula'

wher R« and RQ are different linear o branched perfiuoroaifcylene groups of 2-6 carbon atoms, m and n are independently- ^' 0- 10, and RF is a perfiuoroalkyl group of 1-6 carbon atoms. Another class of perfluoT0(alkyS vinyl) etlters includes eompositiotss of the for.mtila _:

CFHCFO(CF ₂ CFXO) _B Rf where X is F ^' wCF¾ n is 0-S:, and Rf is a perfluoroaikyl group of 1 -6 carbon atoms. Another class of perflu&ro (alkyi vinyl) ethers includes those ethers ^■ -wherein n is 0 or I and Rf contains 1-3 carbon atoms. Additional perfiuoro (alkyi vinyl) ether monomers include compounds of the formula

CF ₂ =CFO CCF ₃ CF(DF ₃ O _i GFjCF ₂ C ₂ 0&CCF2 J _IJ C 2 _!i ,.i where m and n independently are l-l¾ p represents: 0* ₁ and x represents 1~S, Other examples include

groups that may optionally contain one or more catenary oxygen atoms as described, for example, in BP ! 348 072. Also the ally! analogues: may b used, fe. polymers with C -^CFCF O^ «mt instead of he vinyl unit GF^CF-O.. Particular examples of pe Ruo ovin reihers iiiclnde; sO ^:; €F~G~CeF ₃ ):2-OGi¾ F ₂ C-CF-0-(CFi),-OCF _?

!¾C=CF-0-iCF ₂ ) HOCFi) - ,

FjC-eF-0-(€F ₂ 0)-OCF _:; ,

Specific examples of suitable perfluorinatsdvallyl ether comonorriers include:

F;C^CF-CF ₃ -0-C:F ₅

F>C= F¾!¾-i C ₃ F ₇

F ₂ €-eF¾F O-CF -0-(CF¾),F, P ₂ C-CF-CFrO-CF O-iCF ₂ } j"F,

F ₃ G-GF-C 2.Q.f CF¾ j-QCF

P ₃ C= F- FrO-iGF, ,-(GG;F _S ) rf,

F _; C=CF^CF ₃ ~G~GF.-(OCF^ CF ₅ ,

F;C=C F-GF2 _' 0-CF ₂ -iOCFj) 4-CF

F ₂ C<:F-CFr CFjO)4-GSCF ₃ .

Particular examples of perfluori «atecj aikyi ally! ethe (ΡΑΛΕ ^' s) include unsatyrated ethers according to the general fonnuia: wherein R ^s represents a linear o branelM^cyeiie or acyclic perfluori ated alkyl residue, R ^f ma coittaiir li to 16 carbon atoms, e.g, .2* 3, 4. 5, 6, ? _> · 8, 9 or 1 carbon atoms. Freferab!y R ^! contains up to 8, more preferably up to 6 carbon atoms nd most preferably 3 of 4 carbon atoms, fti* may be linear, branched :and it may contain; or m¾ contain a c clic unit SpeeiHe examples of R' inelude perfluoroBieth l preferably C¾F _? or

Mixtures of pert¾©ro:: alky| vinyl) ethers and pierflliO ^' fp (alkoxy vinyl) ethers may also be;ased* as well as mixtures of the Vinyl and ally! ethers described a ove.

Peril uorinate : alk l allyl ethers and alkyl vinyl ethers as described above are either e mmercially iivaOable, for exsiTi ie from Aftles Et i $ Pelerbnrg, Russia or cart be prepared cco ding to methodi described: in U.S. _: Pat. No. 4 49 ₍ 65 . (K sp- j or international patent application no. WO 01 6:19 ( *¾rm ei _. al) or in Modern Flu ropolymers, J . Schehs, Wiley 199? and the references cited therein or by modifications thereof as known to the skilled person,

In one embodiment the tluofopolymer is an FEP polymer and comprises repeating. units derived from TFE, HFP and one or more options! fsuorinated comonoiners, preferably selected from PAVEs and PAAEs. Preferably, the: FEP has a melting point of at greater: than 15 ⁽ F ;

In one embodiment -the fluoropolymer is a THV polymer and comprises repeating units derived: from TFE, OFF and VDF and one or more optional ffuormated eornonorners, preferably selected from PAVEs and PAABs, Preferably the THV has a meltmg point of greater than 150°C.

In :one embodiment he ! uoropolymer is a HTE polymer and comprises repeating units of TFE, HFP. ethylen and one o more optional fluorinated monomers, preferably selected from PAVEs and PAAEs.

in one embodiment the Ottoropolymer is an ETFE polymer and comprises repeating units derived from TFE and ethylene and one or more optional comonomers.

^" Preferably, the fltioropolymers have a melting point between I SO: *C and 3 ^' tS°C, for example between 180 to 289¾ or between 2Q0 and 3&PC.

The fluorothermoplastics may be linear or branched in case they contain branched comonomers like HFP. The polymer may also contain longer branches which may be created, for example* by using branching modifiers in the polymerization as described,; tor example in WQ20O8/ 140914 AT.

Non-melt-processable iluoropoiymers

Non-melt-processable fltioropolymers include PTFE. P FE. is a tetrailuoroethylene iTFE) homopolyrner and inay contain up to 1% by weight of perfluorinated comonomers. Comonomers include perfiuorinated alpha olefins, such as hexaSluoropropylene (HEP). chlorptrifluofOethylene (CTF6), {P-&VES) and allyl ethers (PAAEs).

¾ scail , the PTFEs suitable for the present disclosure ha e a melting: point (after first melting) within the range Ό027 + -!:ø °C. The PTFEs have a melting point of at [east 3 T?^C, preferably at least 3 ί θ¾. arsd more preferably at least 321°C. The PTE E's suitable for the presentidiseiosare inelude high molecular weight PTFE, for example, those having a melt flow index (MFi) of less, than 0,1 g / i O .min t 372 C using a 3 kg load ( FI 372/S) of less than 0.1 /10 mm). on-n ^Jt precifBsa e PTFEs tend to have a standard specific gravity (SSG of et een 2» 13: and 2,23 g/crn ³ as measured according Co AST 4895, The SSG is a measure for the molecular weight of the

than 2,17 for example/an S 3 of het eea2.1 and 2.j Swe PTFE polymers a d their preparation is described, for exampJe, in WO201 1/139807,

PTFEs are conveniently prepared by aqueous emr sioffpolymerization as described for example, in US 2,434,05% US:2,96¾5.95 and EP 0¾3 Q63 A2, EP¾ 969 027. is one embodimen t, the PTFK Ls obtained b suspeBsioil poJ rrie iza ioo:,

Suitable -PTFEs. include, but are not. limited to, c¾fe-sheli polymers. Cere-shell PTFEs and their preparation are described, for ex m le is European Patent No Patent EP 1 535 32 B! and the references cited therein.

hi one embodiment the PTFE polymer contains a periluoroatkyl viuyl ether or a perflueroaikyi ally I ether as co-mon »er, whic!rmay optionally haye oae. or more oxygen atoms in the alkyi chain -. described, .for example, W02012¾)12289 A 1.

The fluoropoiyniers are typicaiiy prepared by aqueous emulsion polymerization asid are obtained as aqueous dispersions, The polymerimtiiHt.is ^' .fyptcsilly .carried oat with fluorinated emu Jsifiers. Typical .emulstfiers include those that correspond to the formula.:

wherein Q represents: hydrogen, CI or P, whereby Q may be presen t hi a ^' terminal position or not f represents a linear or cyclic or branched perfluorinated partially fjuoriiiated ikyiene having 4 to 15 carbon atoms,■-¾ presents an acid anion, such as COO ^" or SC¾rand M represents a cation including an alkali metal anion or an. ammonium ion , Examples flnori nated em ulsifters I nci ude thos described in EP I 059 342, EP 712 882, EP 752432, EP ¾6 397, U 6,025,3 ?, US 6,103,843, US 6,126,849,. US

5,229,480 US 5,763,552; US 5,688,884, US 5,700,859, US 5,895,799, WOOO 22002 and WDO0/71390, ^' Die fluorinai ^' ed.etmdsifiers may be removed in the work up procedure, for ex.a: pk as. described in. W 083/951 ^' 988:.. Fluoroemulsifier-reduced PTFE dispersions are prone to premature coagulation and have, to be stabilized. Preferably, PTFE dispersions are stabilised, for example with non-ioftic or anionic, preferably non-afornaiic, erauls i fsers or by modification of its. polymer architecture or both as described, for example in BP 1 533 325 B I , EP 2902424 A l , EP 1 .529785 Al , W02Q41/014715 A2,

1382004 0171 36, OQ3/059992. Also ether fiyoropoiymer dispersion may be stabiltiied this way,

Various grades of flttisropoiyflier md PTFE dispersi ps are also com ercially available,: for exam le from Dyneori GmbH, Burgkirefoen Germany and from other fluoropafyrner ^' .producers.

In one embodiment the flooropolymers are .peril uoropofymers, such as copolymers of TFE and peril u rov i :n lethers: tha t raay contain. opt sonal oxygen atoms in the peffiuoroai ky I chain (P A ¥Έ) ::¾n , ji iymers of TFB, T1FP and one r mo e PAVE , i l ih-ojje embodiment A blend of two or more fiuoropolymers is. used. The. blends may be bleeds of iTuoropolymers as described above but for example ^; having different melting points and/or P ^' ls. Using a combination of a high melting with a low melting iluoropolymer ma help to prepare a denser article by fheiUtai g the sintering process. ^' The lower meiiinf polymer is; typie ily used i n lower amounts tha the higher melting, ihioropoiy er. The lower melting fluoropolymer may be regarded as a Oiler and may be used in amounts as indicated for fillers.

In .general* the amounts of comonomers are selected to give a polymer with a melting temperature greater than I S0°C or evert greater than 2Q0¾.

The f uoropolymer used in. the 3D-printable eom osifioriS are preferably solids an in the fa m of particles. Typical particle size include partiefes of from about 1 to 158 uro (number average, I¼e . Panicle size of solid parti cles can be determined by microscopy and particle countin software, Compositions of such particles size can be obtained by suspension polymerization of fjuoropolymers, or by milling of pellets or billets, or by agglomeration of f½oropelymer J3ai»icies.-ti ¾i)ned. ^: fi¾im¾muisw polymerization. ¼.on - embodiment, the 3D printable-composition- js in the form of an extrudate, for example a filament, Such compositions are suitable for the filament-deposition methods, Extrudates may be obtained by extruding the compos iilous of fluoropolymer and binder and other ingredients info, filaments.

Binder materials

The 3D printable Ouoropolymer compositions contain ^' one or more binder ihat mehs or liquefies upon exposure to the energy source of the additive processing device.

In one ^■ embodiment the !luoropoiynier typically is provided as a solid composition in form of granuSes or as a powder or as extruded filaments comprising the binder material and other, optional additives. Suitable binder materials include or au!C:m:ateri l , pt¾t½rab y polymers, that have melting points above room temperature, preferably above 40°C (but. below the degradation temperature or melting temperature of thefluoropolymer ). However, also polymers at in a strict scientific sense do not melt but soften or become iess viscous may b used. Typically, the inel ahle binder has a melting pomt or melting range within a temperature from about 0 to about 140-G;, Organic materials are materials that have carbon-carbon a d carbon-hydrogen bonds and the materials may optionally be tiuoriuated, i.e. one or mere hydrogens may be replaced by fluorine atoms. Suitable ^' -materials include hydrocarbon: or hydrocarbon mixture and long chain hydrocarbon esters, hydrocarbon alcohols and combinations thereof and includ ing their fluorinated derivatives. An examples of suitable.materiai includes waxes, sugars, dextrins, thermoplastics havin a melting point as described above, polymerized or cross-linked aeryiaies, methacryiaies, and combinations thereof The waxes may be natural w xes or .synthetic waxes. Waxes are organic compounds coirtaihing long aikyl chains, for example long chairs hydrocarbons, esters of carboxyhc acids ami long chain alcohols and esters of long chairs fatty acids and alcohols, sterols and mixtures and combinations thereof. Waxes also inelude mixtures long chain hydrocarbons;. The termiong cli in" as; used herein means a iriiuimum number of 32 carbon atoms,

! O Natural waxe include beeswax . A major com onent of the beeswax is rnyrieyl paisiii ate which is an ester of tnacentanoi and palmitic acid. Spermaceti occurs: in large amounts in the head oil of the sperm whale, One of its main constituenis is: eetyl palmitai©, Laooiin is a wax obtained from wool, consisting of esters of sterols^ Carnauba wax is a hard wax containing myricyi cerotate.

Synthetic waxes include paraffin: waxes. These a e ¾ drc>^ _. 0n¾,,^Mures-:dt¥tkanSs usually in homokigoifs series of chain lengths. They may meiude saturated, n- and iso- alkaoes, Paphthylenes,, and alkyi- and napftthylene-substituted aromatic compounds. Also fluonnated waxes may e used in which case some hydrogen atoms are replaced by fluorine atoms.

Other suitable waxes can be: obtained b cracking polyethylene or propyleire (" Olyet yleiie wax." or ''polypropylene wa ' ^' ):- The products have the formula (CHjJsl fe, where n ranges between about 50 and 100.

Other e amples of suitable Wa es include but are not limited to eaodeliila wax, oxidized Fischer- Tropscb wax, nne roe rystal line wax, lanolin, bayheny wax _s alm kernel w x, mutton tallow wax, petroleum derived waxes, montan wax derivatives; oxidised polyethylene wax, and corah inations thereof ^' Suitable sugars include for example. and without limitation,, lactose, trehalose, glucose, sucrose, leva lose, dextrose, and combinations thereof.

Suitable dextrins include for example and without I imitation, gamnia-cyclode>drift, alpha- cye!odextrin, beia-ey¾Iodextrio, glueosyl-alpha-cyeiodexirin, nraliosyl-alpba-eyelodexirifi, gjacjosyf-beta-* eyclodextrim maitosyl-beta-eyciodextrin, 2-hydrosy-beta-cyciodextrin, 2-frydroxypropyS-be a _^ ey o extrin, 2 vydroxypropyi-g mma-cycl.odexfriu, faydroxyethyl-beta-cyelodextri n, methy I~beta- eyefodextrin, st fbburylether-a!pba-eyciodextrin, sulfobufyieiher-be a-cyelodextrifs. solfobutyfether- gamma-cyclodextri and combinations thereof,

Suitabie thermoplastfcs include for example and without limitation, ihermoplas&s having a melting point of no greater than U$ ^e G, preferably no greater than Ht C or no greater than 10Q ^q C.

Examples may includ potyethyieneterepijihalate (PET), pofy!aciic acid (PLA), polyvinyl chloride

(PVC), poiymethyt methacry!afe (PMMA), polypropylene (PP), bispfcenol-A polycarbonate (BPA-PC), pol sulffene (PSE), po!yether imide (FBI), ^d com ma ions thereof.

Suitable aerylates and meihaei laies are for example cross-linked or polymerized acr!yateS: ineiudiRg urethane aerylates, epoxy acrylates, polyester aerylates, acrySated (meth)acryltcs, poiyether aerylates, acryiated polyoletlns, and combinations thereof or their meihaerylate analogs.

Other example of su itable binders include but am not limited to binders comprising polymers and polymerized materials selected: from, gelatines, celluloses, ethyl cellulose, rtydroxyl ethyl cellulose, hydroxy.! proj^i cellulose, methyl ceil a lose, hydrox propyl cellulose, cellulose acetate,

|rydroxyb»tylmethyi cellulose, hydroxyethyl cellulose, hydroxyeihylmethyl cellulose, glycoses, fructoses, gyfeogens, collagens, starches, partially f orinated ihennopl stte fluoropPlymers and combinations thereof.

Preferably, the. materials are: of low molecular weight such that they easil degrade.at elevated temperatures for example: at temperatures belo and: including 2Q0°€ and can be easily removed.

1:3 The binde material may be present, .for example, as _. partfc.fes or. may e present for example, as coating on the lluoropoiynier particles. Particle sizes of the binder particles include,, for exantple, from 1 to: ISO μηχ, preferably about 5 micrometers to about 59 m.icrometers, _: snd most preferably about TO micrometers to about 3© micrometers, in one einbodim em. these particle .sizes are average; particle sizes {ntanber aver ge, (Dss or median:. Such particle sizes can be . etemiined by microscopy using particle anaiysing software or ^' from pictures taken from ^' sats.pl.es by microscopes). Generali ^ he average particle size of tiievbinder particles preferably is larger than, that of the fiuoropolymer artieles ibr e mple by a factor between 2 and lOQy preferably % and 10.

The timum anroutu of binder material may be determined by mainly jwo ^' factors* .fitfstthe, amount of binder material should be high enough such that it allows ^'' the .formation of!ayers of the desired dimensions, i.e. it has to be present in effective: amount. Secoudly, the amount should he minimised ^' with respect fothe-fiuoropdlymer conterit-fo i»i« ^' iait§e- ^; shf ¾ n. ^' of/the-artiete during tits working up process, to minimise the voids in. the finished articles created dining the. removal step of the binder material. Since solid compositions are used,, higher fluoropolymer concentrations may be. used than hi the liquid 3D printable compositions, for example a ftuoropolynier content of up to 90% by weight or even up to 95 % by weight (based on the weight of the composition). Typical amounts of binder material include but are not limited to amounts from about 5 to about 20%, from about 8 to about i 8% , for example from about it ⁾ to about 15% by weight, based on the weight of the total composition.

Other, optional, additives include fillers, pigments, UV enhancers and oxidation catalysts, ^'" the 3D-prirttable compositions may -further comprise fillers^ pigments or dyes if .compatible with the 3D printer used and the thermal work up treatment. Fillers may include butare not limited to siSieon earfe-ide., boron nitride, molybdenum sulfide, alumtniim oxides, carbon particles,- such as graphite.or carbon black, carbon fibers, carbon nanotubes. The filler content can be optimized to the system used and may typically be between 0.01 to 10 % or up to 30 % or even up to 50 % by weight based on the total weight of the composition depending on the fluoropo!ymer and binder materials used. The fillers should be in particulate form and fmve sfficienliy small particle size to allow for a homogenous dispersion in the 3D- printable composition. To he compatible; with the jD-printable composition the fitter particles advantageously have a particie size of less than 500 μιη, preferably less than 50 pm r even less than 5 μητ.

Pigments have to be heat-stable at. the temperatures plied in the thermal work up procedures, i.e. at least the melting teinperature of the n,oo~melt processable flaoropoiymer,

Ingredients that increase the irradiation energy absorption from the energy source may also be included in the 3D printable composition. For example, by increasing tire proportion of the applied energy from: the energy source, resulting in. more efficient heating. Some materials absorb none, or a small portion, of the laser wavelength emitted trem an energy source and in sueh a case, these materials are .beneficial. An example ncl de* graphite or carbon black.

Oxidation catalysts may also be included In the 3:D-printable composition to accelerate the combustion of binder daring the: .thermal work t ip procedure. This ma help to create ^; ® smoother surface and to: avoid the formation of surface defects. At is belie ed that when the eombiistion of the binder

may lead t»: o«¾at o vf-m-ieP6b«bWe¾¾r micro -cracks OR .the surfiice. of me sintered article. The oxidation catalyst -may accelerate the combus ion such that the combustion gases hsy ^ evaporated before 5. the fluoropoiyirser particles on the surface fuse. Oxidation catalysts are described for example iri US Pat.

No, , 120 08 and include cerium oxides or other metal oxides.

in one embodiment the ¾ printable c m osition comprises

ft m to 93 % wt, or from 70 to 98:% wb of . a fiuoropolyraer p rt s, preferably of a . size between ί

It) from 5 to 70% or from 5 to 20% of the binder material, preferably a binder material that melts or liquefies at a temperature between 40 and 1 $Q°G _S . preferably between 5 °C and 10O°t3,, preferably n the form of particles having 55 particle size o l¾m 2 ¾ to 30.0μιτι. _ϊ or from Ι Μ to 150 urn.

front 0 to 5Θ % wt of fillers.

from S to ! 5¾ wt, of other optional ingredients wherein the total weight of the composition is 100%.

15

Additive process ng by melting or liquefying a binder material

f r preparing a fluofopolymer article, the 3D printable composition is subjected to additive;

processing in an additis¾ processing device. The 3D-prratabie compositions may be optiinized for ■different types of 3D printers and 31 printin methods.- 0 The solid compositio of particles or the filament composition is entered int the additive processing: machine (3D printer) providing the appropriate heat source, for example a 3D thermal printer ■(having. heat source, such a thermal-print heads) or a selective laser sintering; or melting printer having a laser as heat source, as described above for selective laser ^" melting, or the extrusion device in case of using .an FDM printer,, to create a three-dimensional object. The ^" -resulting object, also referred to as"green body"

25 may be removed from the unreacted powder or fllanient and subjected to a heat treatment, to- remove ^' the: binder material, Goavenienily this is carried out b heat treatment to degrade a«d¾r evaporate the binder .materiai. ^' The temperatures are chosen such that the fluoropolymer article does not melt or gets destroyed. .Such _. ^' fluoropolymers articles will retain their shape. T ^' he heating and subsequent cooling regime may be •eoniroHed to avoi d bending of the object or formation of cracks in the object.

0 T¾e::-estihin object may then be subjected to- -another heat treatment at higher temperatures to allow sintering of the flaoropolymer. During, -sintering- the tluoropo!ymer particles fuse. The temperatures are chosen such that the fluoropoiymer artiele does- not melt or gets destroyed, in case of non-melt rocessab!e tluoropoiyrnets the temperatures may be actually above the meltin temperature of the _:

fiiioropoiy merbiit because of the h igh me It viscosity of the i noropolymer this will not change the: overall

35 shape of the article. The sinterin temperatures may be chosen to be up to about 2(P€ above the melting point of t e fiu-oropo!ymer. For the other types of flnoropolyrners a sintering step may not. be carried out and the temperatures used for degrading and/or removing the bidde may be selected o be below the -.melting point: of the polymer, for example temperatures, at least 1°C below the meltnsg: point or al least K C below the melting point of the fluoro| olymer.

typical heat treatment regime may include, a .first heating, cycle to degrade the binder material followed b ariother heaiirig cycle wherein fhe ieniperatnre of the other heating, cycle is: higher -than that S of the first heating eyele. Durin the first heating -cycle the: article may tuni blaek due: to residues: ©f the binder material, white; the article may turn white after the second heating c cle due to the removal of residual binder. material. Th$ other heat treatment may include sintering, for xample a heat treatment at temperature at or above the melting point of the : Ruoropoiymer, typ ienily a temperatures including, temperattires np to 20°C above the melting point. The heat regimes chosen wil l depend on the type ofG binder material and iluoropolymer used in the 3 D printable compositions and also on the type of article to be prepared.

The final article may have shrunk to some extent compared to the green body. By doing control runs the shrinking can be taken into account when programming the additive processing machine.

Shrinking can be minimised by maximizing the i¼ioropolymer content.

5

Articles

Articles of different shapes, designs and functions may be obtained by the additive processing methods described herein. Such shaped articles: include btit are not limited to bearings., for example friction bearings or piston bearings, gaskets, shaft seals _*, ring lip seals, washer seals, Q-rings, groove0 seals,, valves. nd valve seats, connectors, lids, tubing and containers.. The articles obtained by the

described processes may be components of other articles. In particular articles of small dimensions may be conveniently produced by the methods described herein _* in one embodiments fluofopo!ymer articles '.having -at their longest axis or diameter of from about t), I to■about 200 mm may be produced..

Fluoropolymer articles of big and small dimensions ma be rodnced. The size of the additive5 processing device may set a limitation to the sixe of the articles that may be produced. Articles of small dimensions may also be conveniently produced by the methods described herein. An article comprising a 3D-printed fiijoropolymer can be prepared having a longest axis (as the ease may be this may also be a diameter) that Is smaller than l .tl em or e en smaller than- δ.7 mm. In one embodiment small fluoropolymer articles may be produced having a longest axis or diameter -of from about 0..Θ1. to. about 1.00 mm, or from 0.7 to 1.5 cm. In another embodiment articles may be produced, for example articles having a smallest ax is or diameter of at least 1 , 1 mm.

The tluoropoSyniers may be 3:D-printed _: into ^' rticles that hav at least one element or part of a defmed geometrical shape, Defined geometrical shapes include: but are not limited to circles, semicircles,, ellipses, half-spheres, squares, rectangles, eube¾ polygons (including but not limited to trianglesS hexagons, pentagons, and octagons) and polyhedrons, The shapes may be¾forse-dimens ^' ienal and include pyramids, cuboids, cubes, eyiinders, haif~cylinders, spheres, half-spheres). The shapes also include shapes composed of different shapes like diamonds (combination of two triangles), for exam le,, a honeycomb, s ruc ure ¹ contains several hexagons as geometrical elements. In one embodiment the

IS ■geometries! shape hss 8n-a s-dr- ll^nelieir ofa ¾e^t.¾5 niiliimetres, or at least one millimetre or a least 2 millimetres -or at feast one centimeter, in one embodiment that geometrical ^' shape- has an axis or a diameter of less than: 50 em, or less than 15 e ror even less th n and including 1.5 em or- eves less than and Including ! J mm. In one embodiment, the: article has a wall of a thickness of less than -0.5 em, S prefeabiy less than 6.01 em, far example from l ιη up to I cm, preferably up t»..0,:$ cm r up 0.01 em,

In one embodiriteni of the:;preseni disclosure a iluciopoiymer article is produced containing a 3.D- printed fluoropo!yrner that is a ¾reen body", in such embodiment, tfie. article comprises from Ϊ 0 to 50% by weight of the binder material,,

hi another embod iment of the present disclosure a fluoropolymer article is produced containing8 shaped flnoropolymer that is a "green body". Irs such embodiment, the article comprises from ί to 25 % by weight of a reaction product of a combustion reaction of th binder material,

Fkioropolymer articles of di fferent shapes, designs and functions ma be obtained. Also articles comprising the fluoropoiymer articles of :dlfiereni: designs and ftmetions may be obtained. Exampl s of articles and fluoropolymer articles may include but are not limited to bearings, for example friction5 bearings or piston bearings, gaskets, shaft seals, ring lip: seals, washer : seals, O-rings, grooved seals, valves and: valve seats, c ftneetors¾ lids and containers.:. The article may be medical implants* chemical reactors, screws, cogwheels, joints, bolts, purops, electrodes., heat exchangers, mixers, turbines, electrical transformers, electrical insulators, extraders or the articles may -be components .of other articles inckiding the above articles, The articles may be used in applications where resistance .to acids, bases, fuels,Q Irydroearbons is required; in applfcatiofls where rsQe-stiek properties are inquired, in application where heat resistance is; required and i applications with a combination, of the aibrementioried re uirements,

Preferably, the articles or components -thereof contain the 3P-printed finoropolymer wherein the fiuofopoiyrner has been 3D-pnrsted into sir uctores that contain, one or more than one channels, perforations including through holes and or half holes, honeycomb structures, _, essentially hollow

5 structures and combinations thereof Such simetures may be flat, curved or spherical.

List of partieidar embodiments

The following lists of exemplary embodimen is provided to further illustrate the presentQ disclosure without intending to limit the disclosure to the specific embodiments listed.

List .l

1. Method of producing a fliioropoly nier article comprising subject ing a composition comprising: fluoropoiymer particles to additive processing in a additive processing device cont ining at least5 one- energy source,

2. The method of emb iment 5 wherein: the composition comprises at least One binder. material capable of binding the fkrorop¾jymer particles to form, a ^' layer in a part of the composition that

$7 has been exposed to the energy source of the additive processing device arid the method comprises sufejectin ^' -a part of the- composidoa to exposure of the energ source to form a lay The method of any one of the preceding embodiments wherein the composition comprises at least one binder ^■ material ..capable of ¾sndi?¾ fili ropoiymef particles to fbfrn ; a. layer la a part of the. csmpositi n hat fiss bee« ex osed to the energy source by roe It mg upon exposure of the composition to the energy source: of the add itive rocessing deviee. and wherein the method compri ses subjecting a part of the compositi on to e posur : of t e ^ energy souf to form a layer. The method of any one of the precedin embodiments wherein (lie composition comprises at least one binder material capable of binding fluoropaiymer pariieles to for a layer m a part of the composition that has been exposed to the energy source of the additive .processing device b melting upon exposure of the composition to the energy source of the additive processing device and wherein the method com rise subjecting a part of the, composition to exposure of the energy source to fern* a layer and wherein ..the energy source of the device is a heat source. The method of any one of the preceding em odiments ^' -w er^i - d^o m osltton-com mes at least one binder materia! capable of binding fluoropoiymer particles to fa a layer in a part of the composition that has been exposed to the energy source of the additive processing device and wherei n the binder material fornis a layer by melting upon ex osure of the composit ion to the energy source of the additive processing device and wherein tii additi ve proeessing deviee is a 3D printer selected from selective laser sintering printers, selective Jase-fc melting.. rinters, .3D thermal ^' .printer; electron beam melting printer; he method of any one of the preceding embodiments wherein the composition comprises at least one binder material eapab ie f bifiding fluoropoiymer particles to form a layer ½ a part of the composition that has been exposed to the; energy source of the additi e processing device b melting upon exposure of the composition to the energy source of the additive processing device and wherein the method comprises subjecting a part of the composition to exposure of the energy source to form a layer and wherein the energy source of the device is a: heat source and wherein the binder material has a meiting point Of at least 4t>°C. The method of any one of the preceding embodiments wherein the composition comprises at least one binder material, capable of binding fiuoropolymer particles to form a layer in a part of the composition that has: been exposed to the energy source of .the; additive processing device by melting upon exposure of the composition to the energy source of the additive processing device and wherein the method comprises subjecting a pait of the. -compositio to exposure o f the e n e rg

1» source to i¾ra a layer and ^^fn ^eaerg ::-sot»ce.©i¾$-<le!V-e!e is a heat source and wherein the: binder materia! is a wax. . The method of any one of the preceding embodiments wherein the composition comprises: atieas one 'binder materia) ca able of bindin iluoro otjimer particles to forms a layer in s part of tie composition that has been exposed to the energy source of the additive processing/device by rnehing upon e osure of the composition to the energy: source: of the additive processing device and wherein the method comprises sybjecting:a: art f he composition to exposure oHhe energy sourc to _/ form a layer and. wherein the energy source of the device is aTiest source and wherein the composition is a solid composition of particles. . The method of any one of the preceding embodiments wherein the composition comprises at least one binder materfal capable of bindin fluoropolymer particies to form a layer in a part of.the composition that has been exposed to the energy source -- ^" sif the additi ve processing device b melting upon exposure of the composition to the energy source of the additive processing device and wherein the method comprises subjecting a part of the composition to exposure of the energy source to form, a layer and wherein the energy source of the device is a heat source: and wherein the f tioropolymer particles have a particle size of from abou ί to about 500 pro, preferably from about 1 to about 150 pm.

{{). The method of an one of the preceding embodiments further comprising at least one heat

treatment to remove the binder material

Π . The method of my ^ ^^cedm^m^dm^is^heriia the composition comprises at feast

12. The method of any one of the preceding embodiments wherein the composition comprises at least one binder material capable of bindingflisGropolynier partieles to form, a layer in an area exposed to the energy source of the additive processing device and wherein the method comprises subjecting the article to a heat treatment to remove binder by thermal .degradation.

O, A fiuoropolymer article obtained !- to 12, 4. The a.rtiele of embodinient 13 comprising from Oi l t .3¾% by weight of one or more fiJier, An article comprising a component, wherein the component is a Iluorop lyrtie artiste obtained by a di ive: processing, according o ariy one ^hodiments: V. to ί:2. 3D~pfmta fe:fluc>rapolymer eomposition ¾r 30 printing using a Seat s ufcej t e com o^itiem eoroprfsing l oropoi mer pat icks and a birsdsr materia! that ^■ .melts, .upon ex osure of the composition to theenerg source. The 3D printable composition of embodiment 6, wherein the eomrfositiorj is a solid

composition. Use of a composition of embodiment 16 or 17 for 3D priutisg using a heat source .

Method of producing a fjooropolyii er article comprising subjecting a composition comprising ( uoropolymer particles ar∑ a binder materia! to additive ppocessiag iii an additi ve processing device containing at least one energy source and wherein the fFuorepoiymer is a bomopolymer or copolymer of tetraf!ijor0eth 1e«e (TFE} and wherein the binder nmterial is capable of binding the fluorepotymer particles to form, a layer in a part -of the -com ositi n tha has been exposed to the energy source of the additive processing device and the method further comprises .-..subjecting a part of the eoniposition to ex osure of the energy source to form a layer; Tbe method of 'embodiment ! wherein the jiaoropolymer is a omopolyoter of TFE that may contain up to 1%. fey weight based of perfiuotinated com n iraers Tim method of any one of embodiment 1 or 2 _S wherein the ftuoropo!ymer has a nre!i flow index (MFlji of less than 0. t g / 1:0 mm at 37.2 ⁶ C . using, a Skg oad The method of any one of embodiments: I to 3 viherem ^' the H uotQjpolymer: is ¾ -copQ iise -.©! -Tf E- and wherein the TFE content is from 70% by weight up to but excludiiig 99% by weight. The method of any one of ^' etnbodiments 1 to 4 wherein di f!noropolymer is a copolymer of TFE and wherein the TFE content is from 70% by weight: up to but excluding 99% by weight and therei fluoropolymer has . a melting point betwem 26δ ^σ € and 315?<3. The: method of ^' my. one of embodiments 1 to 5 wherein the fluoropolymer is a copolymer of TFE and wherein the TFE contentis from 70% by weight Up to but excluding ¾% by weight nd wherei.it the f!uofopolymer has an MFI at 3 ^: 72 ^i> C and a 5kg load ro 1 to SOg /lO nun. . The method of an one: of embodiments 1 to 6 wherein the flaorOpo-lymer is a copolymer of TFE and wherein the TFE . content: is from 70 by weight up to but exd ^' udihg:99% by weight and wherein the eoffiononiers are selected f fom ethsne, hexaftuoropropene (HF¾,vinylid:ene fluoride ( V T),: erfluoro ethers, of the general form u-la::-

s here :R¾ and F½ are. different linear or branched perfTuoroalkyiene groups of 2-6 carbon atoms, m and n e ^' independently 0.-1 and Rf is a perfdu roaiicyi -group of t-S e-arbon atoms. . The method of an one of embodiments- 1 to 7 wherein the flaoropoiymer is a copolymer of TFE and wherein the TFE content is from 70% by weight tip to bat excluding 99% by weight and: wherein the fluoropoJymer is selected from PEP ^' (copolymers of T Ev _. hexailuoropropene (FIFE) and optionally perflonrinated vinyl ethers), TH V (copolymers; of TFE, H and vinylktefte fluoride (VPP) _< PFA (copolymers of TFE and perfluoro alkyl vinyl ethers or -perfluoro alkyl ally! ethers),; HTE ( copolymers of TFE, HEP and ethene} and ETFE (copolymers of TFE and etheae}, and oombinadoHS thereof. _: . The method of any one of embodiments 1 to 8 wherein the Hitoropolymer particles have a particle size of _. from 1 to 150 μιη (number average, f½). 0. The method of any one: of embodiments 1 to 9 wherein the binder material melts or liquefies upon exposure to the energ source of the additive processing device and binds or encapsulates l uoropo!yroer particles. 1 . The method of any one of embodiments 1 to 10 vvherein the binder aterial is an organic materia! bav g-.ea-rb0tt<arbon. bonds -and carbon-hydrogen te ds and melts bet een 40 ^C C and l ^' ¾0°C,- preferably between 4€p<3 and 1 0 ^a C. 2; The method of any one of embodiments 1 to 1-1 wherein the binder material is an organic material having carbon-carbon bonds and carbon-hydrogen bonds and liquefies upon- .exposure- to the energy device by which -is meant that the materia! erreapsuia$es;or binds the ttuoropolymer particles. 3. The method of any one of embodiments 1 to i;2 where r he binder material is a wax. 1 . The method of any ime of embodiiiiertts i to 13 wherein the binde materia! comprises organic particles selected from wax, sugars* dexinnS g dAherm Fitestie polymers ^■■ melting between 40¾ and 110 ° _s : ptflyethytene glycols melting between 4< €3 and:: fS0°C : and: polymerized or ero ^' ss-

] inked ^' aerylates, ^' .methacryjates arsd combinations thereof:

15, The method of any one of embodiment

(i) providing a composition comprising a 3D pristable flyoro olymer -compos itioii

comprising fl uoropolymer particles and binder iM ef s f and optionally other ingredie ts ; .

(is) eaMssn the binder to melt or to liquefy and to bind tluoropolymwer artieies by either (a): directing energy from the energy source of the additive proeessmg device lo a selected locatio of the 3D printable composition and causing the binder material to melt o to liquefy and to bind flu ropolyroer particles In the selected location: or (&}: directing a selected location of the 3D printable composition to tiie energj- sotiree asid causing the binder material to melt or to liquefy and to bi»d iluoropolymer particles, or a combination of (a) and i ^' h);

iii} directing either (c) the energy source away from the¾D printable compos ition, or vice- versa (d) directing the 3 D printable composition away from the energy source or both to avoid the binder material to bind fluoropolymer particles ½ the nori-selected: locations, or a combination. n e) asd d);

< iv) repeating steps (ii) and (iii), and if necessary also step (i), to form multiple layers ami create an article.

16. The method of any one: of embodiments ! to 15; wherein the b inder m aterial is a solid particulate materia! ha ving a particle size of from 1 to 150 prn.

17, The metiiod of any one: of embodiments 1 to 16 wherein the composition lla solid coiBposition of particles,

18.. The method of arty one of embo iments 1 to 17 wherein the composition is an extrodahie

composition,

!ftyThe methoil ofany one of embodiments i to 14 and 16 to 18 comprising:

(j) providing an extrtidabie compositio!i comprising a3D printable f1itoi¾po!yraer composition comprising iluoropolymer particles and the binder material and optionally othe ingredients;

(ii) extruding the sompositjoii to a selected location wherein the binder materia! has been molten or liquefied b the energy source of the device t bind the ft oropolymer particles, repeating step: ^' (is) and i f necessary aiso step (i) to form multiple, layers and create an article Ϊ

20, The method of any. one of embodiments j to 9 er in the composition comprises:

S Frorn SO to 95 % wt, preferably front 70 to 90 ¼ t, of ftiorapolyroer particles, preferably of a size between 1 and 150 ^m:

from 5 to 70%, preferably from 3 to :20% af the binder material;

•fer 0 to 50 % \yt. ^: of fillers;

irom tit K5¾ wt..of other optional ingredientswhsreii the total weight, of the com osition is.100%0 wt.

21. The method of ^{" '} any one of embodimen s 1 to 20 further comprtsittg app!y !ng a heat treatment to remove the binder material,' 5 22. A composition for producing m article by additive processing in an. additive processing

eotnpristn he composition: of any one of embodiments 1 to 14 _* 16 to 1.8,20--artd 21.

23. A 3D-printed fluoropolyme -obtainable by the method of any One of embodiments l.io ^; 2L :0 24. A article com risin .a 31 printed fluofopolyraer obtainable by the method of an one of

embodiments I to 21.

25, The article of embodiment 24 selected from friction .bearings, piston bsaiings, gaskets,, shaft seals, ring lip seals, washer seals, O-rmgs, valve seats, .connectors and fids,

5

The disclosure: will now be further illustrate :.by examples and (est method: without in tending the disclosure to be limited to the tests and examples below.

Test Procedures

0

Mel! Fhw Index (MFI):

Melt flow inde can be measured with a melt Indexer (from GSttfert, Werfcstoffprufmasehinen GmbH, Germany) according to DIN EN 1 0 1 133 using a 5 kg load and a temperature of 372 T {MFI 372/5). The coctrnskm time is one. our.

5

^' M ^g llingrg&int;

Melting points can be determined by DSC (a Perkin Elmer differentia! scanning eatorimeier Pyris 1) according to ASTM & 4391 ₁ S mg sam le are heated at a con trolled rate of .l0°C/Mie:to a.tempeTatore of SSi G b ' whieli the:: . i melting iemperattn-e ^" is: recorded. The pks ats then eoolcd: at a .rate, of 10°C/m!« to a temperature of 3( ⁾ 0°C and then reheated at 10°C:%io to a tem erature at SSO-C, The. melting :po ^: i ^: nf observed at the second healing period is referred to herein as the raeStihg point of the polymer (mefiing point of the once molten material),

So/ J C(M(Mt;

The solid content (fiuoropoiymer content) o the. dispersions can he determined graviinetrieaily according _: to ISO 12986, A correction for non-volatile ; morgatiic salts was: not carried out,

SSG e ifv vffiMwepo!ymem:

The _: standard. specific ^' gravity (SSG) can be measured, aoeo.rd.mg ½ ASTM 95,

SSG density (>f the Jlmrop0iym r ar/iefe:

The density of fiuoropo!ymer articles was measured in rt-butyl acetate .according to ASTM 4895,

Exam le 1

1.8 g PFA powder (PFA 6503 PAZ; MF1 ~ 3; average particle size: 27 pm. melteg point 3J. °C) from Dyneon GmbH, Surgki chert Germany, were mix d with 0,2. --g MICROPRO 400 (ffiicromzed polypropylene wax from Micro Powders fnc, Tarryt wn, New York, USA; particle size of 5.0 to 7, mseron., maximum: ^■ particle size ^' 22?. mieron, .melting po ^' tot 140«I 43°C). The: powder rtrtxttire was put m a 5 ml glass jar and rotated on a rolling bank mixer at about 50 rpm for 15 raimrtes. The powder was spread on a piece of paper, 2 sheets of paper were used as a shim and the thickness: of the resulting:

powder layer was approximately 200 micron. It was covered with a 2 mil thick PET film. A soldering iron was heated to 218¾ and the hot tip was slowly: moved over ai approximateiy 1 x 1 em area. Only ^' very slight pressure was applied and the PET film was barely deformed. The powder mixture looked partially melted- where the hot ip had touched the PET film and -. fter the PET film was removed a solid: part of approximately 1 x i em size could be recovered. T e experiment was repeated as described above, but the part Was not recovered and a second layer of powder was spread oniop of the first layer and covered with the PET film. Then the same area of the second layer was heated with the hoi tip. The PE T film then was removed, and the solid part was extracted from the powder. St was observed that the two layers had melted together and formed a solid object.

Exam le 2

1 J g PTFE powder (PTFE pa¾e.TF2fi?3Z} from Py eon GmbH, Bnrgk rcheri Germany, were mixed with 0,2 g ICROPRO.400 {niicro«i¾ed poiypropvlehe wax from Micro Powders Inc, Tarfytown, New Vork, USA: particle size of 5,0 to 7 ) microa, maxi um particle size 22 ^' mioron, rneiting point 14.0-·· 143°C). The powder mixtare was pat in a 50 ml glass jar d rotated on a roiling; bank mixer at about 50 rpm for I I nsmites. The powder was spread n a piece of paper, 2 sheets of pa er were used as a shim

21 and the thickness of the resultmg'powder la er was approximately 2(H) micron. It was covered with a 2 in il thick PET film, A soldering i ron was heated to :31 S^C, an¾ the _: hot tip was $le wfy m ved over an approximately I s i .era area, Qniy very slight ressu e was .applied and the PET film was barely deformed. Th powder mixture looked partially melted w e e the hot tip had touched the. PET film and after the PET film was removed a solid pari of approximately 1 x I cm size could he recovered. The experimerrt was repeated as described above, but t e- -par . as-net reeoveted ^^a^ea -j yer of powder was spread on top of the first layer and covered, with the PET film. Then the same area of the second Saver was heated with the hot tip. The PET film then was removed, and the: solid part was extracted from the powder. The loose powder was trimmed ^" from the edges. The part was determined to weigh t ^' 9:$S:mg. The part was put on a quartz plate in an atmospheric furnace (Hotspot 1 10 Furnace, made hy Zicar Zireonia, Florida. New York, USA) heated from room temperature to: 3 fo*C: i 45 minutes and held at 360°C for 2 -.hours. Tb& _; furnace was allowed to cool to room temperature: and the part was removed. It was dark, grey. The weight oss wsis i 1¾.

Examples 1 atvd 2 demonstrate that three dimens riai object can be created from a powdered bed using/a heat source as is the principle in S thermoprinting or laser melting.

Example 3

In this: example a filamerrt comprised of polylacfie aeki and PTFB was extruded via FDM to make ¾ part:. Pellets were made comprising of #0 _. £¼ Ingeo PLA Biopolymer 4043 D: (Nature Works,

M imietonka, MN 55345} and 40wi TFM 1610 (3M Dyneon). The pellets were then made into a filament of approximately 1,7 mm dsameter fo the isse on a ΨΒΜ 3D printer.

A Hyrei 3D¾ System 30 was used for printing and su ΜΚ2-25Ό extruder head; fo flexible filaments was used,. The nozzle diameter was 0,6 nun, 3D articles (prisms) were printed with approximate dimensions of 4cm x 4cm 1 cm,

The articles can be directly placed a furnace to burn o«t the PLA and sinter the PTFJS. The following conditions: were used: Ramp to \ °C over 4 hours, ramp to 230 ^a C oyer 20 hours, ramp to 275°C over 4 hours, ramp to :325°C over 4 hours, hold at 325°C for 48 hours, ramp to 4Q0°C over 4 hours, hold at 40.0°C for 4 hours, let cool naturally (no active cooling). Upon ½terkg, tire resulting PTFE articles retained their color but non-uniform shrinking. occurred.