Title:
ADHESION FORCE CONFIRMATION METHOD AND ADHESION FORCE CONFIRMATION DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/241090
Kind Code:
A1
Abstract:
The present invention enables conformation that a mold magnetically adhered by a magnetic clamping device has been magnetically adhered by a sufficient adhesion force so as not to be pulled off from the magnetic clamping device by a mold opening force of a mold handling device. A controller 7 carries out magnetization of a magnetic clamping device 10 such that a magnetic adhesion force weaker than that in normal magnetization is generated in a state where molds M1, M2 are bound together, and carries out a test to determine whether separation of the molds M1, M2 would occur when platens 2, 3 are separated. The controller issues a warning regarding lack of guaranteed adhesion force to an operator when separation is detected, and carries out normal magnetization of the magnetic clamping device 10 when separation is not detected.
More Like This:
| JP2003164957 | COOLING METHOD OF DIE FOR CASTING |
Inventors:
AKAMATSU HIROSHI (JP)
Application Number:
PCT/JP2020/016241
Publication Date:
December 03, 2020
Filing Date:
April 13, 2020
Export Citation:
Assignee:
KOSMEK LTD (JP)
International Classes:
B22D17/22; B22D17/32; B29C33/32; B29C45/76; B29C45/84
Domestic Patent References:
| WO2008105033A1 | 2008-09-04 |
Foreign References:
| JP2006224261A | 2006-08-31 | |||
| JP2005515080A | 2005-05-26 | |||
| JP2005515080A | 2005-05-26 | |||
| JP5385544B2 | 2014-01-08 | |||
| JP5683826B2 | 2015-03-11 |
Other References:
See also references of EP 3932587A4
Attorney, Agent or Firm:
KASEGUMA Tsuguhisa (JP)
Download PDF: