Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
ADHESION METHOD EMPLOYING POLYMER MICROPARTICLE-CONTAINING CURABLE RESIN COMPOSITION HAVING EXCELLENT WORKABILITY, AND LAMINATE OBTAINED USING SAID ADHESION METHOD
Document Type and Number:
WIPO Patent Application WO/2019/208569
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing an adhesion method wherein the use of a curable resin composition with a viscosity that is less dependent on temperature results in exceptional workability. The problem is solved by an adhesion method comprising: a step for applying a curable resin composition; a step for extending the curable resin composition; and a step for curing the curable resin composition. The curable resin composition comprises specific amounts of: an epoxy resin; polymer microparticles having a specific amount of cyano groups in the shell layer thereof; and a blocked urethane.

Inventors:
OKAMOTO TOSHIHIKO (JP)
Application Number:
PCT/JP2019/017243
Publication Date:
October 31, 2019
Filing Date:
April 23, 2019
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
KANEKA CORP (JP)
International Classes:
C09J5/06; B32B27/20; B32B27/38; B32B27/40; C09J11/08; C09J163/00; C09J163/02
Domestic Patent References:
WO2016159224A12016-10-06
WO2009034966A12009-03-19
WO2016159223A12016-10-06
WO2016159224A12016-10-06
WO2016163491A12016-10-13
WO2010098950A12010-09-02
WO2014196607A12014-12-11
WO2005028546A12005-03-31
WO2006070664A12006-07-06
Foreign References:
JP2017132953A2017-08-03
JP2016199739A2016-12-01
JP2017132953A2017-08-03
Attorney, Agent or Firm:
HARAKENZO WORLD PATENT & TRADEMARK (JP)
Download PDF: