Title:
ADHESIVE AGENT COMPOSITION, FILM-LIKE ADHESIVE AGENT, DICING/DIE-BONDING ALL-IN-ONE FILM, AND SEMICONDUCTOR AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2021/079968
Kind Code:
A1
Abstract:
This adhesive agent composition contains a thermosetting adhesive agent component and metal particles. The adhesive agent component contains an epoxy resin, a phenol resin, and an elastomer. The metal particles are at least one of a silver-coated metal powder and a silver powder. The metal particle content is 55 to 71 vol% with respect to the total volume of this adhesive agent composition.
Inventors:
SHIRASAKA TOSHIAKI (JP)
NAKAMURA YUKI (JP)
KOSEKI YUTA (JP)
NAKAMURA YUKI (JP)
KOSEKI YUTA (JP)
Application Number:
PCT/JP2020/039826
Publication Date:
April 29, 2021
Filing Date:
October 23, 2020
Export Citation:
Assignee:
SHOWA DENKO MATERIALS CO LTD (JP)
International Classes:
B32B25/14; B32B27/18; B32B27/38; B32B27/42; C08G59/62; C08L63/00; C09J7/35; C09J11/04; C09J121/00; C09J161/06; C09J163/00; H01L21/52
Foreign References:
| JP2012142368A | 2012-07-26 | |||
| JP2012142370A | 2012-07-26 | |||
| JP2017098316A | 2017-06-01 | |||
| JP2012186360A | 2012-09-27 | |||
| JP2012186361A | 2012-09-27 | |||
| JP2015129226A | 2015-07-16 | |||
| JP2015130419A | 2015-07-16 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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