Title:
ADHESIVE AGENT COMPOSITION AND ADHESIVE SHEET, LAYERED BODY, AND PRINTED CIRCUIT BOARD CONTAINING SAME
Document Type and Number:
WIPO Patent Application WO/2022/181613
Kind Code:
A1
Abstract:
[Problem] To provide: an adhesive agent composition having excellent pot life, heat resistance, and adhesive strength, and having a low dielectric constant and a low dielectric loss tangent; and an adhesive sheet, a layered body, and a printed circuit board containing the adhesive agent composition. [Solution] An adhesive agent composition which contains (A) a polycarbodiimide and (B) an amorphous polyol and which satisfies (i) and (ii). (i) The composition does not contain a compound having an isocyanate group. (ii) The composition does not contain a compound having an acid value exceeding 10 eq/106 g.
Inventors:
SAKAMOTO KOICHI (JP)
KAWAKUSU TETSUO (JP)
KAWAKUSU TETSUO (JP)
Application Number:
PCT/JP2022/007251
Publication Date:
September 01, 2022
Filing Date:
February 22, 2022
Export Citation:
Assignee:
TOYO BOSEKI (JP)
International Classes:
B32B27/00; B32B27/34; C09J7/30; C09J11/06; C09J167/00; H05K1/03
Domestic Patent References:
| WO2020218174A1 | 2020-10-29 |
Foreign References:
| JP2013075972A | 2013-04-25 | |||
| JP2007204562A | 2007-08-16 | |||
| JP2012131967A | 2012-07-12 |
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