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Title:
ADHESIVE APPLICATION EQUIPMENT
Document Type and Number:
WIPO Patent Application WO/2021/182496
Kind Code:
A1
Abstract:
Provided is adhesive application equipment that is capable of applying a necessary, sufficient amount of an adhesive to a strip-shaped thin steel plate without causing an increase in equipment costs. The present invention provides adhesive application equipment having: an adhesive application device that includes adhesive discharge holes (26) and (27) from which an adhesive is discharged toward an adhesive application surface of a strip-shaped thin steel plate; a means that is capable of lifting and lowering the adhesive application device; and adhesive supply ports (17) and (18) from which the adhesive is supplied to the adhesive application device at a prescribed pressure, wherein the adhesive discharge holes (26) and (27) are separated inward from an end surface of the adhesive application device, which comes into contact with the strip-shaped thin steel plate, so that a prescribed distance is maintained between a bottom surface of the strip-shaped thin steel plate and the adhesive discharge holes.

Inventors:
KUROSAKI EIICHI (JP)
Application Number:
PCT/JP2021/009446
Publication Date:
September 16, 2021
Filing Date:
March 10, 2021
Export Citation:
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Assignee:
TANAKA SEIMITSU KOGYO CO LTD (JP)
International Classes:
H02K15/02; B05C5/00; C09J5/00; C09J5/06; C09J201/00
Domestic Patent References:
WO2019168022A12019-09-06
WO2019167803A12019-09-06
Foreign References:
JP2001321850A2001-11-20
JP2015076970A2015-04-20
JP2019103217A2019-06-24
JP2001025218A2001-01-26
Attorney, Agent or Firm:
IWATANI Ryo (JP)
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