Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
ADHESIVE COMPOSITION AND COUPLING STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2021/199756
Kind Code:
A1
Abstract:
One aspect of the present invention pertains to a coupling structure that comprises: a first circuit member having a first electrode; a second circuit member having a second electrode; and a connection part which is provided between the first circuit member and the second circuit member and which electrically connects the first electrode and the second electrode. The first electrode and/or the second electrode has a layer composed of Cu or Ag at the outermost surface thereof. The connection part contains conductive particles each having a layer composed of Pd or Au at the outermost surface thereof.

Inventors:
MORIJIRI TOMOKI (JP)
SHINOHARA KENGO (JP)
MATSUKAWA AYAO (JP)
Application Number:
PCT/JP2021/005961
Publication Date:
October 07, 2021
Filing Date:
February 17, 2021
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
SHOWA DENKO MATERIALS CO LTD (JP)
International Classes:
C09J9/02; H01B1/00; H01B1/22; H01L21/60; H01R11/01
Foreign References:
JP2013149774A2013-08-01
JP2013214417A2013-10-17
JP2007094412A2007-04-12
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
Download PDF:



 
Previous Patent: TACTILE SENSOR SHEET

Next Patent: MAGNETIC SENSOR DEVICE