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Patent Searching and Data


Title:
ADHESIVE COMPOSITION, FILM-LIKE ADHESIVE, ADHESIVE SHEET, DICING/DIE-BONDING INTEGRATED ADHESIVE SHEET, SEMICONDUCTOR APPARATUS, AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2021/002248
Kind Code:
A1
Abstract:
Disclosed is an adhesive composition containing an epoxy resin, a curing agent, an elastomer, and a filler, wherein the elastomer comprises a polyurethane resin.

Inventors:
HIRAMOTO YUYA (JP)
NATSUKAWA MASANORI (JP)
UEDA ASAMI (JP)
Application Number:
PCT/JP2020/024650
Publication Date:
January 07, 2021
Filing Date:
June 23, 2020
Export Citation:
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Assignee:
SHOWA DENKO MAT CO LTD (JP)
International Classes:
C09J163/00; C09J7/30; C09J11/06; C09J11/08; C09J161/04; H01L21/301; H01L21/52; H01L25/065; H01L25/07; H01L25/18
Domestic Patent References:
WO2012160916A12012-11-29
WO2018235854A12018-12-27
Foreign References:
JP2012241134A2012-12-10
US20110070436A12011-03-24
JP2019077758A2019-05-23
CN104449513A2015-03-25
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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