Title:
ADHESIVE COMPOSITION, ADHESIVE LAYER, AND ADHESIVE SHEET
Document Type and Number:
WIPO Patent Application WO/2023/002981
Kind Code:
A1
Abstract:
The present invention provides: an adhesive composition which is capable of forming an adhesive layer that has a low dielectric constant and a low dielectric loss in a high frequency band, while having dielectric characteristics that are not susceptible to the influence of moisture and being suitable for bonding of members that constitute a millimeter wave antenna; and an adhesive sheet. An adhesive composition according to the first aspect of the present invention has a dielectric constant of 2.0 to 5.0 at a frequency of 28 GHz, a dielectric loss of 0.0001 to 0.05 at a frequency of 28 GHz, a saturation moisture absorption of 2.8% or less at 65°C and 90% R. H., and an amount of dielectric loss change of 0.006 or less as calculated by the formula below. (Amount of dielectric loss change) = Dfmax – Dfmin
Inventors:
SASAHARA KAZUKI (JP)
KATAMI HIROFUMI (JP)
TAKAHASHI TOMOKAZU (JP)
KATAMI HIROFUMI (JP)
TAKAHASHI TOMOKAZU (JP)
Application Number:
PCT/JP2022/028057
Publication Date:
January 26, 2023
Filing Date:
July 19, 2022
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
C09J201/00; C09J7/38; H01Q1/38; H01Q1/40
Domestic Patent References:
| WO2012173039A1 | 2012-12-20 | |||
| WO2021024303A1 | 2021-02-11 | |||
| WO2022114097A1 | 2022-06-02 | |||
| WO2022070899A1 | 2022-04-07 | |||
| WO2022070900A1 | 2022-04-07 | |||
| WO2022070901A1 | 2022-04-07 |
Foreign References:
| JP2013194170A | 2013-09-30 | |||
| JP2015174907A | 2015-10-05 | |||
| JP2015040237A | 2015-03-02 | |||
| JP2017066295A | 2017-04-06 | |||
| JP2015000874A | 2015-01-05 | |||
| CN110708406A | 2020-01-17 | |||
| JP2022053541A | 2022-04-05 |
Attorney, Agent or Firm:
G-CHEMICAL INTELLECTUAL PROPERTY FIRM (JP)
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