Title:
ADHESIVE COMPOSITION, ROOM-TEMPERATURE-CURABLE ADHESIVE, AND CURED OBJECT
Document Type and Number:
WIPO Patent Application WO/2022/163523
Kind Code:
A1
Abstract:
A purpose of the present invention is to provide an adhesive composition capable of giving cured objects having excellent mechanical properties. The adhesive composition according to one aspect of the present invention comprises a polyoxypropylene-based polymer (A) having a number-average molecular weight of 5000 or higher and having, at ends, 0.6 or more (meth)acryloyl groups on average, a methacrylate compound (B), a homopolymer of which has a glass transition temperature exceeding 60°C, an organic peroxide (C), and a reducing agent (D).
Inventors:
TANAKA HIDENORI (JP)
Application Number:
PCT/JP2022/002172
Publication Date:
August 04, 2022
Filing Date:
January 21, 2022
Export Citation:
Assignee:
KANEKA CORP (JP)
International Classes:
C08F290/06; C09J4/02; C09J11/06; C09J171/02
Domestic Patent References:
| WO2020100832A1 | 2020-05-22 |
Foreign References:
| JPS60219276A | 1985-11-01 | |||
| JPS61148277A | 1986-07-05 | |||
| JP2012107140A | 2012-06-07 | |||
| JPH0326779A | 1991-02-05 | |||
| JPS5984964A | 1984-05-16 | |||
| JP2021088632A | 2021-06-10 |
Attorney, Agent or Firm:
HARAKENZO WORLD PATENT & TRADEMARK (JP)
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