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Patent Searching and Data


Title:
ADHESIVE COMPOSITION, ADHESIVE TAPE, AND METHOD FOR PROCESSING WAFER
Document Type and Number:
WIPO Patent Application WO/2013/105582
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide: an adhesive composition having excellent heat resistance, which has high adhesive power and can still be easily released; an adhesive tape which uses the adhesive composition; and a method for processing a wafer, wherein the adhesive tape is used. The present invention is an adhesive composition which contains a photocurable adhesive component, a photopolymerization initiator, and a gas generator that generates a gas when irradiated with light. The gas generator is dispersed in the adhesive composition with a dispersion diameter of 0.05-37 μm.

Inventors:
TONEGAWA TORU (JP)
ASAO TAKAHIRO (JP)
Application Number:
PCT/JP2013/050237
Publication Date:
July 18, 2013
Filing Date:
January 09, 2013
Export Citation:
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Assignee:
SEKISUI CHEMICAL CO LTD (JP)
International Classes:
C09J201/00; C09J7/02; C09J11/06; C09J133/06
Domestic Patent References:
WO2011118506A12011-09-29
WO2012036209A12012-03-22
Foreign References:
JP2011204793A2011-10-13
JP2010132755A2010-06-17
JP2006096860A2006-04-13
JP2012062369A2012-03-29
Attorney, Agent or Firm:
YASUTOMI & Associates (JP)
Patent business corporation Yasutomi international patent firm (JP)
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Claims: