Title:
ADHESIVE COMPOSITION, ADHESIVE TAPE, AND METHOD FOR PROCESSING WAFER
Document Type and Number:
WIPO Patent Application WO/2013/105582
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide: an adhesive composition having excellent heat resistance, which has high adhesive power and can still be easily released; an adhesive tape which uses the adhesive composition; and a method for processing a wafer, wherein the adhesive tape is used.
The present invention is an adhesive composition which contains a photocurable adhesive component, a photopolymerization initiator, and a gas generator that generates a gas when irradiated with light. The gas generator is dispersed in the adhesive composition with a dispersion diameter of 0.05-37 μm.
Inventors:
TONEGAWA TORU (JP)
ASAO TAKAHIRO (JP)
ASAO TAKAHIRO (JP)
Application Number:
PCT/JP2013/050237
Publication Date:
July 18, 2013
Filing Date:
January 09, 2013
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD (JP)
International Classes:
C09J201/00; C09J7/20; C09J11/06; C09J133/06
Domestic Patent References:
| WO2011118506A1 | 2011-09-29 | |||
| WO2012036209A1 | 2012-03-22 |
Foreign References:
| JP2011204793A | 2011-10-13 | |||
| JP2010132755A | 2010-06-17 | |||
| JP2006096860A | 2006-04-13 | |||
| JP2012062369A | 2012-03-29 |
Attorney, Agent or Firm:
YASUTOMI & Associates (JP)
Patent business corporation Yasutomi international patent firm (JP)
Patent business corporation Yasutomi international patent firm (JP)
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Claims: